Stud Ball Bumping (SBB) Bonding Capillary

Stud Ball Bumping Capillaries

With continuous die size shrinkage and finer bond pad pitches of less than 60um, this solder bumping process is expected to be the future option for packaging technology miniaturization. For CSP flip chip application, solder bumping of wafer are done either by electroplating method to form the 63Sn-37Pb solder balls, and the other method is by gold (Au) ball bonds formed on the aluminum bond pad (Al) by a conventional wire bonder. Special designed capillary is needed to meet the different bond pad pitches. The general design rule on the desired mashed ball (MBD) given the bond pad opening still applies. However, since there is no looping, the capillary with 20 deg main taper angle (MTA) is one of the design features.

Stud Ball Bumping CapillariesStud Ball Bumping Capillaries

Recommended Stud Ball Bumping Capillaries from SPT


ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - SBB CapillariesPRICE QUOTE - email us at sales@epakelectronics.com
How To Order SBB Capillaries


BONDING CAPILLARIES & ACCESSORIES WE OFFER:

Non-Fine Pitch Capillaries (UT)UT NON-FINE PITCH CAPILLARIES
QFN (Quad Flat Non-Lead) SQ Capillary for gold and copper wire bondingQFN PACKAGE COPPER & GOLD WIRE BONDING CAPILLARY
Copper Wire Bonding Capillaries (SU)COPPER WIRE BONDING CAPILLARY
Enhanced Stitch Bond CapillariesENHANCED STITCH BONDABILITY
Advanced Bonding ApplicationsADVANCED BONDING APPLICATIONS
AZR Copper Bonding Capillary MaterialAZR LONG LIFE MATERIAL FOR CU WIRE BONDING
INFINITY 3X LONGER TOOL LIFEINFINITY 3X LONGER TOOL LIFE
Ball Stitch On Ball Wire Bonding CapillariesBALL STITCH ON BALL (BSOB)
Stud Ball Bumping (SBB) Bonding CapillarySTUD BALL BUMPING
Several different taper styles are available: One Side Relief, Double Side Relief, 90 Degree Double Side Relief and Vertical Bottle NeckSPECIAL CAPILLARY TAPER DESIGNS
Capillary unblocking and unplugging wireCAPILLARY UNPLUGGING WIRE (CUW)
EFO Wands for Capillary Bonding by SPTEFO WANDS
Window Clamps & Heater Block For QFP SOP & Multi-lead PackagesWINDOW CLAMPS & HEATER BLOCK
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