Stud Ball Bumping (SBB) Bonding Capillary
With continuous die size shrinkage and finer bond pad pitches of less than 60um, this solder bumping process is expected to be the future option for packaging technology miniaturization. For CSP flip chip application, solder bumping of wafer are done either by electroplating method to form the 63Sn-37Pb solder balls, and the other method is by gold (Au) ball bonds formed on the aluminum bond pad (Al) by a conventional wire bonder. Special designed capillary is needed to meet the different bond pad pitches. The general design rule on the desired mashed ball (MBD) given the bond pad opening still applies. However, since there is no looping, the capillary with 20 deg main taper angle (MTA) is one of the design features.
ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE) Part Number - SBB Capillaries
How To Order SBB Capillaries
BONDING CAPILLARIES & ACCESSORIES WE OFFER:
 UT NON-FINE PITCH CAPILLARIES
 QFN PACKAGE COPPER & GOLD WIRE BONDING CAPILLARY
 COPPER WIRE BONDING CAPILLARY
 ENHANCED STITCH BONDABILITY
 ADVANCED BONDING APPLICATIONS
 AZR LONG LIFE MATERIAL FOR CU WIRE BONDING
 INFINITY 3X LONGER TOOL LIFE
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BALL STITCH ON BALL (BSOB)
 STUD BALL BUMPING
 SPECIAL CAPILLARY TAPER DESIGNS
 CAPILLARY UNPLUGGING WIRE (CUW)
 CAPILLARY UNPLUGGING PROBE (CUP25PB)
 EFO WANDS
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