Epak Electronics Ltd provide bonding tools,capillaries,co2 cleaning machines,abrasive blasters,thin film and thick film chip resistors and semiconductor bonding and processing equipment from Comco Inc, Deflex, SEC,SPT,MSI,RPS,AI Technology,AIT,UV Process Supply,DTIC, spares for Solitec spinners and coaters

Epak Electronics Ltd is a European based technical agent for a range of products that are used in production and manufacturing. Our products are primarily used in electronics, medical, aerospace, research, museums, military and printing.

The range of products we supply includes high specification thin film and thick film chip resistors for military, space, medical and telecommunications industries, glass wall and metal packages, specialist adhesives and epoxies for the electronics industry, CO² cleaning systems, micro-abrasive systems for surface preparation cleaning and rework, soldering test systems and solder pots, dispensing equipment and a range of die bonding tools, capillaries and bonding wedges.

Epak undertakes the installation and subsequent servicing of all our principals products along with support and technical backup.

Our newest product line covers UV curing equipment and spares, safety products, printing supplies, ink and coating handling products.

Latest:

DID YOU KNOW ? Mini-System Inc (MSI) have never made any parts obsolete! Since 1968 all the resistors, networks, arrays and attenuators Mini-Systems Inc. have manufactured, all of the parts are still available, and there are no plans to change this policy now or in the foreseeable future.

Parts obsolescence is becoming a major problem for aerospace, military and satellite manufacturers. With the cost of re-designing specifications, re-qualification and testing requirements, this is becoming an increasing problem.

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

Giving an overview in some of the uses for micro-abrasive technology for applications such as Stent Processing, Wafer Drilling & Machining, Coating Removal and Surface Preparation and Wafer Bevelling.

Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed. Designed to take from 30mm to 150mm (6") wafers. Click here for more details

Also available is our SA150 & SA300 Surface Abrader

08/03/2013 15:32