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SOLDERING EQUIPMENT

    Solderability Test Equipment

Robotic Process Systems is one of the world leaders in the sale of Solderability Test Equipment. RPS manufactures dip and look testers, low volume dipping systems, rotary dip testers for PWBs and steam aging equipment. The ANSI J specifications have changed some of the requirements of solderability testing, but RPS equipment is capable of doing all forms of testing whether it be ANSI J or MIL-SPEC 202 method 208. 

202 TL Solderability Test System

 The RPS 202TL™ is a microprocessor-controlled solderability test system that meets MIL-STD-202, method 208/MILSTD-2000 with speed and precision. All process parameters are set digitally. The microprocessor is capable of storing 8 different processes in memory for fully automatic operation. These process parameters include: flux and solder emersion and immersion speed, solder, flux and traverse dwell times, number of cycles required and solder temperature. The RPS 202TL also has a calibrated depth gage that permits adjustments to 0.001" over the flux and solder pots.  

A wide range of tooling for different parts is available and we can also offer a rotary had for QFP type parts.

Applications 

  • Solderability Testing of Pre-Tinned and Steam-Aged Components for Various Specifications, including Military Standards

    Data Sheet for the RPS 202-TL

     

    A larger model, the RPS 202TL-2™ features 2 solder pots to perform such applications as burning off gold coatings in the first pot, then tinning in the second.

    Custom Rotary Head attached to RPS 202-TL2

    A custom 360 Degree rotary head is available as an option for QFP packages. Custom tools can be supplied for your application. Call us for further information.

    Data Sheet for the RPS 202-TL-2


RDT-1000 Automated PWB Coupon
Solderability Test System

The RDT 1000™ is a fully automated PWB coupon test system that streamlines circuit board coupon solderability testing while satisfying the Rotary Dip Test methods as specified in MIL-STD 275E and ANSI-J-STD-003. The system is extremely simple to learn and operate, even for non-technical personnel. The RDT 1000 features unique flexibility with adjustable dwells, feed rates and temperature settings at all stations: fluxing, drain, pre-heat, solder dipping, and freeze. The compact, bench top design is built to deliver years of reliable service even in the most rugged production environments.

RDT 1000 Automated PWB Coupon Solderability Test System

 

 

 

Applications 

  • Simplifies The Coupon Test Process In Both Circuit Board Fabrication And For Production Assembly Applications

  • Doubles As A Pre-Tinning And Solder Dipping Machine For Small Volume Runs

Data Sheet for the RPS RDT-1000


Steam Aging Systems

 The precision steam aging systems in the RPS ST Family™ are specifically designed to meet military and commercial Hi-Rel specifications (MIL-STD 202, Method 208 and others) for artificial aging of all electronic components and circuit boards, including high density, discrete components. They offer complete monitoring and control of steam or water temperature and feature automatic timing of the test duration. The large steam chamber is designed so that steam may be safely vented. The ST-2D featured 3 individually timed, ESD protected drawers with a unique closure mechanism that reduces steam escapement during drawer removal. 

Constructed of treated stainless steel, these steam agers are virtually unaffected by de-ionized or distilled water. Elapsed time and cycle time are indicated digitally. The cycle timer will not time the cycle unless temperature is within process parameters. The unit automatically shuts down at the end of the pre-programmed cycle. The cover is designed so that steam is condensed and channeled to the side. Condensation is kept away from components. 

Steam Aging System

 

 

 

 

Applications 

  • Artificially Ages Components Over a Very Narrow Temperature Range, Typically At 93°C, ±3° Of Steam Temperature  

Data Sheet for Steam Aging System

Solder Pots

We at RPS pride ourselves on the quality of our solder pots, backed by a 1-year warranty. Our pots are constructed of heavy gauge stainless steel, ceramic insulation, and the best heaters available. This combined with our heater rail construction to help the pot keep its shape means many years of trouble-free operation. Most of our solder pots are also available with optional automatic dross wiping mechanisms, and nitrogen inerting.

 

Applications   

  • Static Models - Suitable For All Basic Tinning Applications, Including Lead Attach

  • Dynamic Models - Evenly Heats Solder with Integral PID Proportional Temperature Control with Dual Display 

Data Sheet for Static and Dynamic Solder Pots

POT SIZES AND SPECIFICATIONS

Type

Size

Capacity

Max Temp Range

Useable Depth

Electrical
Watts     VAC/1PH

 Static

2" x 4"

6 lbs

600° F

2.5"

400

120

 

4" x 6"

25 lbs

750° F

3"

720

120

 

6" x 12"

75 lbs

750° F

3.5"

1250

120/240

 

8" x 19"

250 lbs

750° F

6"

5400

240

 

7" x 25"

325 lbs

750° F

6"

540

240

Dynamic

2" x 4"

75 lbs

600° F

2.5"

1250

120/240

 

5" x 8"

190 lbs

750° F

3"

2500

240

 

5" x 14"

250 lbs

750° F

3"

5400

240

 

09/03/2010 16:03

EPAK
Latest  News:
09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

14.01.2010 Southern Manufacturing Show. Epak Electronics Will be exhibiting at Southern Manufacturing in Farnborough 10th & 11th February 2010.

#500 Exhibitors

# FREE Tickets (when pre-booked)

# FREE Parking

# FREE Seminars

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

16.04.09 Comco to Exhibit at InterSolar Munich

Comco Inc. will exhibit micro-abrasive blasting equipment at the InterSolar Munich show, May 27-29, 2009, New Trade Fair Center, Munich, Germany booth A3.208.

 

11.01.09

       27.10.08       SPT RTR-D2/D3 series pickup tips for thin or fragile components 
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

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