Phone: +44 (0)1460 61791
Email: sales@epakelectronics.com

Epoxies, Adhesives & Thermal Management

Adhesives & Epoxies - stress free and electrically conductive & non-conductive materials films and greases

We are the UK supplier for AI Technology who produce an extensive range of high quality epoxy, adhesive films, pastes, thermal interface materials, materials for die attach, encapsulation and potting compounds. Module assembly, PCB assembly, heat sink attach, LCD assembly & EMI, RFI EMP shielding, CoolPAD™, CoolGREASE™, CoolGEL™, materials for CPU & MCU thermal interfaces, Laser & IR device potting materials, MCM assembly adhesives, BGA & uBGA die attach adhesives, and overcoat potting materials, Flip-Chip Bumps & Thermal interface Flip-Chip Adhesives, and mis-matched CTE materials.

Many AiT products are available to Mil Std 883D as well as NASA & ESA outgassing qualification standards.

Materials from AiT can be supplied in one or two part components, syringe, in pre-formed films, sheets in various sizes and in jars.

Automotive Electronic & Electrical Adhesives

Adhesives for automotive electronics manufacturing.
Electro-Thermal & Dielectric-Thermal Die-Attach
Thermal interface materials, gels and greases for automotive applications.
Module Mounting and Sub-Mounting Thermal Adhesives
Compressible Phase-Change Thermal Interface Pads

Automotive Electronic & Electrical Adhesives, Thermal Management Products and Thermal Interface Materials.

Coatings & Protection

Conformal coating for electronic circuit board protection
UV Blocking And Resistant Protection Coatings With Outstanding Moisture Barrier and Resistance
Ultra Hydrophobic, Non-Hygroscopic, moisture Blocking Coatings for wiring boards and electronic devices.
Anti-Static Masking Tape and Film Form Dispensing Masking Coating and Masking Gel for Masking and Protection in Conformal Coating Processes
Wafer processing film and spin coating adhesives

Coatings & Protection Materials

CPU Cooling

Die attach and thermal interface materials for CPU, GPU, Memory Modules for laptops, tablets and mainframe computers to supercomputers and multi-core desktop computers

CPCM is the patented compressible phase-change material (CPCM) version of COOL-SILVER™ grease. That is, COOL-SILVER™ CPCM may cool your computer by as much as 4-8°C in over-clocking applications
Compressible Phase-Change Thermal Interface Pads
Compressible Thermal Gap Pad Thermal Interface
Thermal Interface for the Ever More Powerful Graphic Processor Unit (GPU) Module
COOL-SILVER™ CPU Grease
COOL-TIME™ Thermal Material Cleaning Solution

CPU, GPU Cooling Materials

Custom Material Solutions

Provides high performance sealing and shielding that is both moisture and chemical resistant, Ideal for all RF, mobile communication applications.
Custom Materials & Adhesives
Large area and mis-match substrate film and paste adhesives
Speciality coating for extreme moisture and temperatures
Pressure-sensitive and curable coatings and adhesives
UV curable film and paste adhesives and coatings
Dry or pressure-sensitive epoxy film adhesives with different electrical, mechanical, thermal, and electromagnetic properties
Dry or pressure-sensitive thermoplastic film adhesives with different electrical, mechanical, thermal, and electromagnetic properties
Speciality polymer-based material solutions to meet your specific manufacturing and performance requirements

Custom Material Solutions

Dicing, Lapping and Grinding Tapes

AIT is the only manufacturer of dicing tapes that can withstand high temperature exposure. This unique ability to tolerate high temperatures is further enhanced with unique anti-static highly stretchable substrate. UV-release versions with different peel strengths are also available as well as Melt Bond Temporary tapes.
AiT Dicing & Lapping Tapes
Dicing & Grinding Tapes

Dicing, Lapping and Grinding Tapes

Die, Substrate and Component Attach Materials

A range of flexible epoxy, thermosetting or thermoplastic materials for COB, MCM, TAB, LSI plastic, LSI ceramic, VLSI plastic, VLSI ceramic die attach.AIT has many proven epoxy paste adhesives for thermal management in component and substrate attachment.
AiT Die Attach Materials
Die Attach Pastes
Die Attach Films Substrate and Component Attach
Substrate Film Adhesives
Component & Substrate Paste Adhesives
Die, Substrate and Component Attach Materials

Die, Substrate and Component Attach Materials

EMI, RFI and ESD Shielding and Protection

Conductive, corrosion resistant, silicone and polymer based adhesives with a wide variety of fillers which include, silver, gold, diamond, copper, aluminium etc. EMI/RFI Compressible Gasket Sheet Materials
Shielding Caulks and Adhesives
Melt-Bonding Lid-Shield
ESD Protection Coatings & Materials
EMI Shielding Tips and FAQs

EMI, RFI and ESD Shielding and Protection

Flex Circuit Materials

Flexible advanced circuit substrate materials
COUPLER™ Flexible Circuit Material
Solderable Flexible Circuit Materials For Fine-Pitch And Super-Fine Pitch Flexible Circuit Applications
Solderable Flexible 1 and 2-Sided Copper Laminate Flexible Circuit Substrate Materials
Flexible Pre-Preg for Flex Circuits and Interposers
Flexible Pre-Preg for Power and LED Modules

Flex Circuit Materials

LED Materials

LED Thermal Interface Materials and materials for LED manufacturing

LED Die-Attach Adhesive with proven high Thermal Conductivity and Low Thermal Interface Resistance
LED Submount and LED Module mounting Thermal Film Adhesive with Instant Melt-Bonding
Compressible, Conformal Phase-Change Thermal Interface Pad for LED Heat-Sink
Insulated Metal Thermal Substrate for Metal-Core Printed Wiring Board (MCPCB) with 2X Thermally Conductivity for LED Submout and LED Module

LED Materials

Lid Seal Solutions

An extensive selection of materials, providing flexible and re-workable thermosetting epoxy films and pre-forms for lid, substrate, heat sink and die attach.
Solderable Insulating Lids
Lid seal materials
Lid Attach Dispensable Insulating and Conductive Adhesives
Solderable Ceramic, Glass and LCP Lids
Pre-Applied Adhesive Preforms
EMI Shielding Covers, Lids, and Caps without soldering
SNAP-LID® Adhesive Preform Pre-application
COOL-LID® Lid Attach to Combine with Thermal Management
LID-SEAL: Low Cost Sealing, Thermal & Shielding Solutions

Lid Seal Solutions

MIL-STD 883C 5011.4 Compliant Materials

Proven and qualified adhesives for die, component, and substrate attach applications.
MIL-STD 883C Method 5011.4 Qualified Adhesive Products

Test Procedures: Mil-Std 883C Method 5011.4
Test Conditions: Per Specification
Acceptability: Both material characteristics and system level performances must meet requirements
ESP8350 FlexibleAmbient storagedry epoxy film
ME7155 1-component flexibleepoxy paste
ME7156-NG 1-component flexibleepoxy paste
ME7159 1-component flexibleepoxy pasteDiamond filled
ME8412 1-component rigidepoxy paste
ME8456 1-component flexibleepoxy paste
ME8456-GE 1-component flexibleepoxy paste
ME8456-00 1-component flexibleepoxy paste
TC8750 Tacky epoxy film
TP8550 Dry thermoplastic film
TP8650 Dry thermoplastic film

MIL-STD 883C 5011.4 Compliant Materials

NASA Outgassing Compliant Materials

AiT have a list of products from AIT that has years of proven success in NASA and ESA outgassing compliant adhesives for space applications.
NASA-ESA Outgassing Qualified Products:

Test Procedures: ESA: PSS-01-792; NASA: ASTM E595-90
Test Conditions: 125OC for 24 hours @ 10-3 Pa (<10-5 Torr)
Acceptability: Total Mass Loss (TML) <1%
Volatile Condensable Materials (CVCM) <0.1%
Water Vapor Regained (WVR) NR

AIT Product:
EG7635
EG7635
EG7655
EG8050
EG8050-HC
ME7155
ESP8350
RTK7659
TC8750
TC8750
TK7755 Epoxy Foil Sandwich
TP7205
TP7209
TP8205
Note: Most Adhesives made by AIT will pass NASA requirements. Please call AIT or fill out our contact form to find a material for your specific need.

NASA Outgassing Compliant Materials

Optical and Optoelectronic Materials

AiT Opto-Bond™ is a range of products designed for the fibre optic / optoelectronic components manufacturing arena, all are UV curable.

Optical and Optoelectronic Materials

Solar Panel Materials

AiT Solar Solutions - solar panel manufacturing materials

SOLAR-IMB™ Thermally Conductive Insulated Metal Back Sheet
Thermally Conductive Back Sheet
Lowers Cell Temperature for Higher Efficiency
Thermally Conductive Insulated Metal Back Sheet

SOLAR-THRU™ Encapsulation Transparent Front Sheet
PVDF Encapsulating Transparent Front Sheet for Proven Performance
Proven UV Resistant
Encapsulating Transparent Front Sheet

SOLAR-TAB™ Lower Temperature Tabbing Interconnection

Solar Panel Materials

Thermal Management Materials

A range of materials that have been specifically designed to draw heat from the die or device to the heat sink, included are Cool-PAD™, Cool-GREASE™, Cool-GEL™, Cool-LID™, Cool-BOND™
AiT Thermal Interface Materials & Insulated Metal Substrates
Compressible Phase-Change Interfaces
Thermal Film and Paste Adhesives
Thermal Gels & Greases
LED Thermal Interface Materials
Thermal Interface Materials for CPU, GPU and Memory
Insulated Metal Substrate Copper Clads & Pre-Preg

Thermal Management Materials

Underfill and Encapsulation Materials

Chip and component protection underfill & encapsulation materials

Liquid Underfills with Ultra-high Glass Transition (Tg)
High Melt-Flow Film Underfill for FOW
Underfill Liquids and Film Adhesives

Underfill and Encapsulation Materials