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EPOXIES & ADHESIVES

We are the UK supplier for AI Technology who produce an extensive range of high quality epoxy, adhesive films, pastes, thermal interface materials, materials for die attach, encapsulation and potting compounds. Module assembly, PCB assembly, heat sink attach, LCD assembly & EMI, RFI EMP shielding, CoolPAD™, CoolGREASE™, CoolGEL™, materials for CPU & MCU thermal interfaces, Laser & IR device potting materials, MCM assembly adhesives, BGA & uBGA die attach adhesives, and overcoat potting materials, Flip-Chip Bumps & Thermal interface Flip-Chip Adhesives, and mis-matched CTE materials.

Many AiT products are available to Mil Std 883D as well as NASA & ESA outgassing qualification standards.

Materials from AiT can be supplied in one or two part components, syringe, in pre-formed films, sheets in various sizes and in jars.

NEW AiT Cool-SILVER™ Materials

COOL-SILVER™ CPCM is the patented compressible phase-change material (CPCM) version of COOL-SILVER™ grease. That is, COOL-SILVER™ CPCM may cool your computer by as much as 4-8°C in over-clocking applications

Cool Silver

AiT Die Attach Materials

A range of flexible epoxy, thermosetting or thermoplastic materials for COB, MCM, TAB, LSI plastic, LSI ceramic, VLSI plastic, VLSI ceramic die attach.

Die Attach Pastes
Die Attach Films

AiT Substrate and Component Attach

AIT has many proven epoxy paste adhesives for thermal management in component and substrate attachment.

Component & Substrate Paste Adhesives
Substrate Film Adhesives

AiT Lid Attach Materials

An extensive selection of materials, providing flexible and re-workable thermosetting epoxy films and pre-forms for lid, substrate, heat sink and die attach.

Lid Seal Preforms

Solderable Insulating Lids

AiT Thermal Interface Materials & Insulated Metal Substrates

A range of materials that have been specifically designed to draw heat from the die or device to the heat sink, included are Cool-PAD™, Cool-GREASE™, Cool-GEL™, Cool-LID™, Cool-BOND™

Compressible Phase-Change Interfaces

Thermal Film and Paste Adhesives

Thermal Gels & Greases

Insulated Metal Substrate Copper Clads & Pre-Preg

Flexible and Advanced Circuit Substrate Materials

This is a solderable flexible HDI-Interposer providing chip to laminate, direct soldered interconnection. A variety of contact finishes can be implemented like Nickel-Gold, copper, palladium etc.

Solderable Flexible 1 and 2-Sided Copper Laminates

Low Pressure Copper Pre-Preg

Advanced Circuit Substrate Materials

AiT EMI / RFI / EMP Shielding Materials

Conductive, corrosion resistant, silicone and polymer based adhesives with a wide variety of fillers which include, silver, gold, diamond, copper, aluminium etc.

EMI/RFI Compressible Gasket Sheet Materials

Shielding Caulks and Adhesives

Melt-Bonding Lid-Shield

ESD Protection Coatings & Materials

EMI Shielding Tips and FAQs

AiT MIL-STD 883C 5011.4 Compliant Materials

Proven and qualified adhesives for die, component, and substrate attach applications.

MIL-STD 883C Method 5011.4 Qualified Adhesive Products

AiT NASA Outgassing Compliant Materials

A list of products from AIT that has years of proven success in NASA and ESA outgassing compliant adhesives for space applications.

NASA-ESA Outgassing Qualified Products

AiT Custom

Provides high performance sealing and shielding that is both moisture and chemical resistant, Ideal for all RF, mobile communication applications.

Custom Materials & Adhesives

AiT Zif-FILM™

An area array interconnect film that can have electrically conductive and non-electrically conductive area's within the same piece. This is a flexible and stress free, dry film adhesive ideal for a wide range of applications.

AiT Stress-Free™ NEW

An instant bonding film and rapid-Curing adhesive for either large area die or small high power die and substrate attach.

NEW AiT Opto-Bond™ NEW

A new range of products designed for the fibre optic / optoelectronic components manufacturing arena, all are UV curable.

AiT Dicing & Lapping Tapes

AIT is the only manufacturer of dicing tapes that can withstand high temperature exposure. This unique ability to tolerate high temperatures is further enhanced with unique anti-static highly stretchable substrate. UV-release versions with different peel strengths are also available as well as Melt Bond Temporary tapes.

Dicing & Grinding Tapes

AiT PCB Assembly Materials

A selection of pastes, films, gels and greases all manufactured for the assembly of PCB's. Epoxies for thermal underfill, potting, component attach and solder replacement.

Intel Flash Ram Chip Technology using AIT Materials AIT Materials suppiled in all sizes of jars, syringes, 2 part or premixed variations

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