Lid-sealing Solutions for Optical, Thermal, EMI and Commercial Component and Module packaging

Optical Transparent Sealing and Electronic Lid Seals - Opto-electronics and Optically Clear Adhesives

Optical Transparent Sealing And Electronic Lid Seals

This series of advanced novel low temperature curing sealing solutions offer unparalleled moisture barrier and low stress protection to electronics and other devices for the extreme working environments.

The low thermal expansion coefficient (CTE) ensures low stress interface bonding between the covers, lids and protective surfaces when matched against metals, ceramics and glasses. They are ideal for sealing optical devices such CMOS camera and LED lighting devices.

The tight inter-penetrating network and the high glass transition of beyond 240°C formed by the cured sealing adhesives provide outstanding moisture barrier and protection against moisture even at saturating moisture and boiling water environments.

CMOS Device

AI Technology also formulated sealing solutions in the form of:
Thixotropic Pastes: To ensure controlled flow for confined and defined lid and cover sealing applications.
Low Viscosity Wicking Liquids: To ensure capillary flow capability to enable sealing large areas and difficult to apply interfaces.
This engineered capillary flow property also enables filling into crevices and form self-leveling covers for optical and electronic protections.
Self-Leveling Sealing Preforms: To provide high volume controlled manufacturing environment for optical and electronic devices.

Electronic Lid Seals And Environmetal Seals

AIT Part #Dispensing GuidelinesCuring GuidelinesTg (Glass Transition Temperature)CTE (ppm/°C)Gross & Fine Leaks
MC 7883 Dispense on covers or devices to be sealed Provide for adhesive flow during curing
  • 150°C for 30 min
  • 175°C for 3 min
  • 200°C for 6 sec
240°C 20 Pass
MC 7880 Dispense only minimal amount of the low viscosity liquid Provide for adhesive flow during curing
  • 150°C for 30 min
  • 175°C for 3 min
  • 200°C for 6 sec
240°C 30 Pass
MC 8880 Dispense on covers or devices to be sealed Provide for adhesive flow during curing
  • 150°C for 30 min
  • 175°C for 3 min
  • 200°C for 6 sec
240°C 25 Pass


Lid Seal Application Guidelines:
Dispense onto perimeter cover to be placed as seal (preferred)
Provide for pre-heating of devices to be sealed to prevent air expansion blow out

AIT Part #Dispensing GuidelinesCuring GuidelinesTg (Glass Transition Temperature)CTE (ppm/°C)Gross & Fine Leaks
MC 3800 Dispense only minimal amount of the low viscosity liquid Provide for adhesive flow during curing
  • 100°C for 90 min
  • 125°C for 30 min
  • 150°C for 10 min
  • Do not cure or exposure to higher than 150°C
240°C 30 Pass
CXP 3880 Cut adhesive perform to size of cavity to be filled Provide for proper thickness to allow the perform to flow and fill the cavity
  • 100°C for 90 min
  • 125°C for 30 min
  • 150°C for 10 min
  • Do not cure or exposure to higher than 150°C
240°C 30 Pass

Optical Transparent Sealing Application Guidelines:
MC 3800 is a low viscosity liquid that is ideal for wicking into capillary to seal glass and other hard to get to interfaces. The coloured liquid will change to colourless transparent thin film as outstanding moisture barrier.
CXP 3800 is a self-levelling film that will flow under heat to fill into cavity. Provide for pre-heating of devices to be sealed to prevent air expansion blow out.

CONTACT US FOR Optical Transparent Sealing And Electronic Lid SealsPRICE QUOTE - email us at sales@epakelectronics.com
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ADHESIVES, EPOXIES AND FILMS AVAILABLE:

Automotive Electronics Adhesives and Thermal Interface MaterialsAutomotive Electronic & Electrical Adhesives
Coatings & Protection MaterialsCoatings & Protection
High Performance CPU and GPU Cooling ApplicationsCPU Cooling - COOL-SILVER™
Custom Adhesives, Epoxies, Pastes and Film MaterialsCustom Material Solutions
Dicing, Lapping and Grinding TapesDicing, Lapping and Grinding Tapes
Die Attach Pastes, Adhesive and Film MaterialsDie, Substrate and Component Attach Materials
Lid Seal Solutions and PreformsLid Seal Solutions
Thermal Management Materials, Gels, Greases and FilmsThermal Management Materials
EMI, RFI and ESD Shielding MaterialsEMI, RFI and ESD Shielding and Protection
Flexible Circuit Adhesives and materialsFlex Circuit Materials
LED Manufacturing Adhesives and MaterialsLED Materials
MIL-PRF 883C Section 5011 Compliant materialsMIL-STD 883C 5011.4 Compliant Materials
NASA and ESA Qualified Adhesives and FilmsNASA Outgassing Compliant Materials
Optical and Optoelectronic MaterialsOptical and Optoelectronic Materials
Solar Panel Adhesives and Advanced MaterialsSolar Panel Materials
Underfill and Encapsulation MaterialsUnderfill and Encapsulation Materials