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NASA-ESA OUTGASSING QUALIFIED PRODUCTS

A list of products from AIT that has years of proven success in NASA and ESA outgassing compliant adhesives for space applications.

Test Procedures: ESA: PSS-01-792; NASA: ASTM E595-90

Test Conditions: 125OC for 24 hours @ 10-3 Pa (<10-5 Torr)

Acceptability:  Total Weight Loss (TWL) <1%
                      Volatile Condensable Materials (VCM) <0.1%

                      Water Vapor Regained (WVR) NR

 

(Click on the Product for the TDS.)

AIT Product
%TWL
%VCM
%WVR
(Cured at 100OC @ 5 min.)
0.57
0.016
0.21
(Cured at 150OC @ 5 min.)
0.84
0.070
0.64
(Cured at 150OC @ 16 hr.)
0.08
0.010
0.01
(Cured at 150OC @ 5 min.)
0.54
0.067
Not reported
(Cured at 150OC @ 16 hr.)
0.28
0.053
Not reported
 ME7158
(Cured at 125OC @ 24 hr.)
0.30
0.045
Not reported
(Cured at 100OC @ 4 hr.)
0.51
0.100
Not reported
(Cured at 150OC @ 16 hr.)
0.23
0.031
Not reported
(Cured at 150OC @ 24 hr.)
0.27
0.040
Not reported
(Cured at 150OC @ 4 hr.)
0.58
0.090
Not reported
(Cured at 100OC @ 5 hr.)
0.25
0.050
0.05
(Cured at 150OC @ 30 min.)
 0.28
0.070
0.06
(Post bonding baked at 150OC @ 30 min.)
0.78
0.080
0.08
(None)
0.38
0.080
0.28
(Post bonding baked at 150OC @ 30 min.)
0.38
0.060
0.06
TP7759
(Post bonding baked at 250OC @ 0.5 sec.)
0.25
0.010
0.23

 

 

18/09/2008 07:34

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

EPAK
 

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