NASA and ESA Qualified Adhesives, Epoxies and Materials

Nasa and ESA Qualified Adhesives, Epoxies and Film Materials

Many AiT products are available to Mil Std 883D as well as NASA & ESA outgassing qualification standards. Materials can be supplied in one or two part components, syringe, in pre-formed films, sheets in various sizes and in jars.

A list of products from AIT that has years of proven success in NASA and ESA outgassing compliant adhesives for space applications.

NASA-ESA OUTGASSING QUALIFIED PRODUCTS
Test Procedures: ESA: PSS-01-792; NASA: ASTM E595-90
Test Conditions: 125OC for 24 hours @ 10-3 Pa (<10-5 Torr)
Acceptability:  Total Weight Loss (TWL)<1%
Volatile Condensible Materials (VCM) <0.1%
Water Vapour Regained (WVR) NR

(Click on the Product for the TDS.)
AIT Product
%TWL
%VCM
%WVR
EG8050Cured at 100OC @ 5 min.)
0.57
0.016
0.21
EG8050-HC(Cured at 150OC @ 5 min.)
0.84
0.070
0.64
ESP8350(Cured at 150OC @ 16 hr.)
0.08
0.010
0.01
ME7155(Cured at 150OC @ 5 min.)
0.54
0.067
Not reported
ME7158(Cured at 150OC @ 16 hr.)
0.28
0.053
Not reported
 ME7158(Cured at 125OC @ 24 hr.)
0.30
0.045
Not reported
ME7158(Cured at 100OC @ 4 hr.)
0.51
0.100
Not reported
ME7159(Cured at 150OC @ 16 hr.)
0.23
0.031
Not reported
ME7159(Cured at 150OC @ 24 hr.)
0.27
0.040
Not reported
ME7159(Cured at 150OC @ 4 hr.)
0.58
0.090
Not reported
ME8456(Cured at 100OC @ 5 hr.)
0.25
0.050
0.05
TC8750(Cured at 150OC @ 30 min.)
< >0.28
0.070
0.06
TP7205(Post bonding baked at 150OC @ 30 min.)
0.78
0.080
0.08
TP7209(None)
0.38
0.080
0.28
TP7758(Post bonding baked at 150OC @ 30 min.)
0.38
0.060
0.06
TP7759(Post bonding baked at 250OC @ 0.5 sec.)
0.25
0.010
0.23

CONTACT US FOR NASA / ESA MATERIAL SELECTIONPRICE QUOTE - email us at sales@epakelectronics.com

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