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NASA-ESA OUTGASSING QUALIFIED PRODUCTS

A list of products from AIT that has years of proven success in NASA and ESA outgassing compliant adhesives for space applications.

Test Procedures: ESA: PSS-01-792; NASA: ASTM E595-90

Test Conditions: 125OC for 24 hours @ 10-3 Pa (<10-5 Torr)

Acceptability:  Total Weight Loss (TWL) <1%
                      Volatile Condensable Materials (VCM) <0.1%

                      Water Vapor Regained (WVR) NR

 

(Click on the Product for the TDS.)

AIT Product
%TWL
%VCM
%WVR
(Cured at 100OC @ 5 min.)
0.57
0.016
0.21
(Cured at 150OC @ 5 min.)
0.84
0.070
0.64
(Cured at 150OC @ 16 hr.)
0.08
0.010
0.01
(Cured at 150OC @ 5 min.)
0.54
0.067
Not reported
(Cured at 150OC @ 16 hr.)
0.28
0.053
Not reported
 ME7158
(Cured at 125OC @ 24 hr.)
0.30
0.045
Not reported
(Cured at 100OC @ 4 hr.)
0.51
0.100
Not reported
(Cured at 150OC @ 16 hr.)
0.23
0.031
Not reported
(Cured at 150OC @ 24 hr.)
0.27
0.040
Not reported
(Cured at 150OC @ 4 hr.)
0.58
0.090
Not reported
(Cured at 100OC @ 5 hr.)
0.25
0.050
0.05
(Cured at 150OC @ 30 min.)
 0.28
0.070
0.06
(Post bonding baked at 150OC @ 30 min.)
0.78
0.080
0.08
(None)
0.38
0.080
0.28
(Post bonding baked at 150OC @ 30 min.)
0.38
0.060
0.06
TP7759
(Post bonding baked at 250OC @ 0.5 sec.)
0.25
0.010
0.23
 

03/09/2010 09:06

EPAK
Latest  News:
09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet
18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

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