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DIE ATTACH PASTES & ADHESIVES
AIT offers some of the most advanced Die Attach paste adhesives
engineered to improve long-term reliability, rapid inline curing, long
pot-life, viscosity and thixotropic control for fast automated dispensing and
manufacturing. Some of the following representative products have
more than 20 years of reliability data for military and aerospace
applications.
 
Click
on the Product for the TDS
Electrically Conductive Paste
Adhesives
|
AIT
Product
|
Characteristics
|
Electrical Resistivity
(ohm-cm)
|
Thermal Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg (oC)
|
Viscosity/
Thixotropic IndeX
|
|
|
-One or two part component
|
<2x10-4
|
>5.7
|
>1,700
|
50
|
150,000
(cps@ 0.5 rpm)
|
|
|
-Solder replacement
-Stress free
-Substrate/component
|
<4x10-4
|
>7.9
|
>1,500
|
-20
|
129,000
(cps@ 0.5 rpm)
|
|
|
-Solder replacemernt
-Stress free
|
<4x10-4
|
>7.9
|
>1,800
|
-20
|
190,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Solvent free
|
<4x10-4
|
>7.9
|
>1,500
|
-20
|
354,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Solvent free
-Large area die attach
|
<4x10-4
|
>7.9
|
>2,000
|
-20
|
255,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Large area die attach
|
<4x10-4
|
>7.9
|
>2,000
|
-20
|
130,000
(cps@ 0.5 rpm)
|
|
|
-Ideal for mismatched CTE's
|
<4x10-4
|
>7.9
|
>1,500
|
-20
|
60,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Designed to eliminate bleeding
|
<4x10-4
|
>7.9
|
>1,600
|
50
|
910,000
(cps@ 0.5 rpm)
|
|
|
-High green strength
-Moisture resistant
|
<4x10-4
|
>7.9
|
>1,000
|
-55
|
20,000
(cps@ 5 rpm)
|
|
|
-Solvent free
-Fine pich
-Rapid curing
-Meets MIL-STD 883 5011.4
|
<2x10-4
|
>8.6
|
>2,500
|
50 |
8,000
(cps@ 0.5 rpm)
TI >4.0
|
|
|
-Solvent free
-Fine pich
-Rapid curing for inline process
-Meets MIL-STD 883F 5011.4
|
<5x10-4
|
>8.6
|
>2,400
|
80
|
15,000
(cps@ 5 rpm)
TI >4.0
|
|
|
-Solvent free
-Fine pich
-Rapid curing
-Meets MIL-STD 883F 5011.4
|
<4x10-4
|
>7.9
|
>1,000
|
-20
|
8,000
(cps@ 0.5 rpm)
TI >4.0
|
|
|
-Solvent free
-Fine pich
-Rapid curing for inline process
-Meets MIL-STD 883F 5011.4
|
<4x10-4
|
>7.9
|
>1,000
|
-20
|
15,000
(cps@ 5 rpm)
TI >4.0
|
|
|
-Stress free
-High Green Strength
|
<5x10-4
|
>7.9
|
>1,000
|
-20
|
15,000
(cps@ 5 rpm)
|
AIT offers many other Die Attach paste adhesives not shown on our
web site. Please go to Products
Application Form to receive a recommendation from our office on
your specific application.
Non-conductive Paste Adhesives
|
AIT
Product
|
Characteristics
|
Electrical Resistivity
(ohm-cm)
|
Thermal Conductivity
(watt/m-oC)
|
Die-shear
(psi)
|
Tg
(oC)
|
Viscosity
|
|
|
-Stress free
-One or two component
-Large bonding areas
|
>1x1014
|
>1.7
|
>1,800
|
-20
|
300,000
(cps@ 0.5 rpm)
|
|
|
-Substrate attach
-Large bonding areas
-Bonding mismatched CTE's
|
>1x1014
|
>3.67
|
>1,800
|
-25
|
337,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Stress free
|
>1x1014
|
>1.7
|
>1,800
|
-25
|
276,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Stress free
|
>1x1014
|
>3.6
|
>1,800
|
-25
|
245,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Mismatched CTE's
|
>1x1014
|
>1.7
|
>2,400
|
-25
|
144,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-High power die attach
|
>1x1014
|
>3.6
|
>1,800
|
-25
|
250,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Diamond filled
|
>1x1014
|
>11.4
|
>1,800
|
-25
|
310,000
(cps@ 0.5 rpm)
|
|
|
-Stress free
-Moisture resistant
|
>1x1014
|
>3.6
|
>1,600
|
-55
|
20,000
(cps@ 5 rpm)
|
|
|
-Solvent free
-Rapid inline curing
-More than 7 days pot-life
-Meets MIL-STD 883F 5011.4
|
>1x1014
|
>1.6
|
>2,800
|
-20
|
10,000
(cps@ 0.5 rpm)
TI >3.0
|
|
|
-Solvent free
-Rapid inline curing
-More than 7 days pot-life
-Meets MIL-STD 883F 5011.4
|
>1x1014
|
>1.8
|
>2,800
|
65 |
10,000
(cps@ 0.5 rpm)
TI >3.0
|
|
|
-Stress free
-Fast curing
|
>1x1014
|
>3.6
|
>1,200
|
-10
|
200,000
(cps@ 0.5 rpm)
|
|
|
-Solvent free
-Low temperature curing
|
>1x1014
|
>1.7
|
>2,000
|
80
|
20,000
(cps@ 5 rpm)
|
|
|
-Solvent free
-High Green Strength
|
>1x1013
|
>2.9
|
>1,200
|
-60
|
60,000
(cps@ 5 rpm)
|
AIT offers many other Die Attach paste adhesives not shown on our
web site. Please go to Products
Application Form to receive a recommendation from our
office on your specific application.
To achieve the highest level of ease in
component soldering operations without pre-baking, AIT die-attach pastes have
been engineered with molecular structure of low moisture absorption.
This low moisture absorption is reflected in the consistent bond strength
under extreme moisture exposure.
With the increase usage of lead-free
soldering, high temperature stability is critical. Low weight loss is
engineered into AIT die-attach paste adhesives using stable molecular
structure. The following weight loss measure is a good indicator of the
ability of AIT die-attach pastes in withstanding a higher temperature
soldering operation and long-term high temperature applications.
To
enhance the productivity of the die-attach operations, AIT die-attach pastes
for commercial high volume applications have been designed with 100% solids
without diluent or solvent. The use of fast curing agents enables the adhesive
to cure rapidly. They are ideal for in-line curing manufacturing without
additional post curing.
AIT
designed die-attach pastes for high volume commercial applications
with long pot-life to ensure success in the manufacturing operations.
18/01/2012 03:50
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