AUTOMOTIVE ELECTRONIC ADHESIVES & THERMAL INTERFACE MATERIALS FOR POWER ELECTRONICS

AUTOMOTIVE ELECTRONIC ADHESIVES & THERMAL INTERFACE MATERIALS FOR POWER ELECTRONICS

Unique Challenges for Automotive Electronic Adhesives & Thermal Interface Materials:

While typical aspects of die-attach, component attach, substrate attach and thermal management are the same for all of the automotive electronics, automotive electronics operational temperature tends to be a lot higher and conditions a lot harsher.

The temperatures of power electronics like insulated gate bipolar transistors (IGBTs) can operate around 150C. Some electronics may be exposed to solvents (fuels) and other chemicals.

AI Technology have over 30 years of experience in inventing and formulating speciality adhesives for electronic applications, AIT provides one of the most comprehensive thermal interface solutions that are engineered to facilitate manufacturability and throughput:

High thermal automotive power electronic die-attach pastes
Compressible pressure sensitive thermal tape and thermal film adhesives that have been proven industry best to provide instant bonding and lowest thermal resistance for large area module mounting
Conformal compressible phase change or pressure sensitive thermal interfaces for modules to heat-sink thermal interface for largest displays
Camber-free insulated metal thermal substrate for metal-core printed wiring board (MCPWB) with measurable 2x better thermal conductivity

Automotive Electronic Adhesives & TIMs

AIT application engineering, sales, chemists, and material scientists are ready to serve your special needs and applications in electronics for automotive applications. Please inform us of your requirements using the Contact tab or click on the button below:

Adhesives and Thermal Interface Materials for Automotive Electronics

What distinguishes AIT automotive electronic adhesive and thermal management material solutions besides the unparalleled and proven low thermal resistance in the die-attach, module mounting and heat-sink thermal interfaces are the long-term reliability and consistent performance after years of thermal shock and cycling with the build-in stress relief, and molecular structures that are engineered to prevent “drying” or cracking inside the materials and along the interface surfaces.

Electro-Thermal & Dielectric-Thermal Die-Attach

Low Thermal Resistance for Higher Power Automotive Electronics
Modified Epoxy for camber-free Bonding
Maintain Stable Bond Strength for Extreme Thermal Shock and Cycling

PROPERTY/PARAMETER

ME 8512

ME 8456-DA

MC8880

ME 7519-LB

Electrical Resistivity

<0.0003 ohm-cm

<0.0003 ohm-cm

<0.003 ohm-cm

>10¹⁴ ohm-cm

Viscosity @5.0 rpm/Thixotropic Index

10,000 cps/4.0

20,000 cps/4.0

10,000 cps/4.0

20,000cps/>3

Glass Transition Tg (°C)

52

-20

220

52

Device Push-off Strength (psi)

>3000

>2000

>3000

>3000

Hardness (Type)

~ 80D

~ 80A

~ 99D

~ 85D

Cured Density of Conductive Adhesive Portion (gm/cc)

4.0

4.8

4.0

2.5

Thermal Conductivity

> 12.0 W/m-°K

> 12 W/m-°K

> 8 W/m-°K

> 12 W/m-°K

Linear Tab-Composite Thermal Expansion Coefficient  (ppm/°C)

40 (X-Y=Z,  Isotropic)

90 (X-Y=Z,  Isotropic)

26 (X-Y=Z,  Isotropic)

45 (X-Y=Z,  Isotropic)

Maximum Continuous Operation Temperature (°C)

> 180

> 180

> 250

> 180

Decomposition Temperature @5% weight loss (°C)

>450

>450

>500

>450

Recommended Curing Temperature/Time (°C/min.)

>175/10

>175/10

>150/10

>175/10

Lowest Possible Die-Attach Thermal Interface is the Foundation of Automotive Power Electronics Thermal Management:

Die-Attach thermal management is the first and most critical layer of the thermal stacks in a power electronic and LED module devices. Highest thermal conductivity with thin and void-free bond-line of the die-attach adhesive is critical in dissipating the heat quickly to the broader sub-mount and eventually to the heat-sink.

Module Mounting and Sub-Mounting Thermal Adhesives

PROPERTY/PARAMETER

RTK 7555

RTK 7554

ME 7519-LB

Thermal Conductivity

> 0.2 W/m-°C

> 0.2 W/m-°C

> 0.2 W/m-°C

Dielectric Strength (Volts/mil)

>550

>300

>750

Device Push-off Strength (psi)

>1000

>1000

>1000

Cured Density (gm/cc)

2.5

2.5

2.5

Thermal Conductivity

> 3.0 W/m-°C

> 8.0 W/m-°C

> 12 W/m-°C

Maximum Continuous Operation Temp. (°C)

> 150

> 150

> 150

Electrical Resistivity

>10¹⁴ ohm-cm

>10¹⁴ ohm-cm

>10¹⁴ ohm-cm

Extreme Thermal Adhesive for Module Mounting

Instant Bonding Compressible Pressure Sensitive Adhesive Pad
Melt-tacking and In-situ Curable Low Thermal Resistance Film Adhesive
Proven Lower Junction and Device Temperature

Compressible Phase-Change Thermal Interface Pads

Compressible and conformal couples with phase change to allow elimination of voids
Proven for most stringent applications including military applications
US patented innovation
Non-silicone and non-contaminating

Other AIT Thermal Interface Materials for Automotive Power Electronics Applications

FUNCTION

AIT PART #

THERMAL, ELECTRICAL AND OTHER RELEVANT PROPERTIES

Compressible Phase-Change

COOL-SILVER™ PAD CPR8850-LB

  • Lowest thermal resistance, electrically non-conductive interface pad
  • Compressible, phase-change interface pad  (US patented)

Compressible Phase-Change

COOL-SILVER™  G3 PAD

  • Lower cost version of the lowest thermal resistance pad
  • Compressible, phase-change interface pad  (US patented)

Compressible Phase-Change

COOL-PAD™  CPR7158

  • Modified aluminum nitride filled with one of the lowest thermal resistance
  • Compressible, electrically insulating phase-change pad (US patented)

Compressible Phase-Change

COOL-PAD™  CPR7155-LB

  • Modified aluminium oxide filled with one of the lowest thermal resistance
  • Compressible, electrically insulating phase-change pad (US patented)

Gap-Filling Thermal Pad

COOL-GAPFILL™

DT, TT

  • Gap filling compressible  thermal pad with the lowest thermal resistance
  • One-side tacky (DT) or both side tacky (TT) for different applications

Compressible Gel-Film

COOL-GELFILM™

SZ

  • Thin compressible gel like film
  • Non-curing thin bond-line thermal interface

Thermal Grease

COOL-SILVER™

G3 Grease

  • Non-curing, electrically non-conductive interface grease
  • Lowest thermal resistance, non-silicone, proven long-term stability

Thermal Grease

COOL-GREASE™

CGR7559-LB

  • Lowest thermal resistance, electrically insulating interface grease
  • Non-curing, non-silicone, proven long-term stability

Thermal Gel

COOL-SILVER™

G3 Gel

  • Non-curing, electrically non-conductive interface gel forming paste
  • Non-silicone grease, proven thermal stability similar to thermal pad

Electro-Grease

COOL-GREASE™

CGR8550

  • Non-curing, electrically conductive interface grease for moving parts
  • Lowest thermal resistance non-silicone grease, proven long-term stability

ESP8350

CONTACT US FOR MIL-STD 883C METHOD 5011.4 QUALIFIED ADHESIVE PRODUCTS SELECTIONPRICE QUOTE - email us at sales@epakelectronics.com

ADHESIVES, EPOXIES AND FILMS AVAILABLE:

Automotive Electronics Adhesives and Thermal Interface MaterialsAutomotive Electronic & Electrical Adhesives
Coatings & Protection MaterialsCoatings & Protection
High Performance CPU and GPU Cooling ApplicationsCPU Cooling - COOL-SILVER™
Custom Adhesives, Epoxies, Pastes and Film MaterialsCustom Material Solutions
Dicing, Lapping and Grinding TapesDicing, Lapping and Grinding Tapes
Die Attach Pastes, Adhesive and Film MaterialsDie, Substrate and Component Attach Materials
Lid Seal Solutions and PreformsLid Seal Solutions
Thermal Management Materials, Gels, Greases and FilmsThermal Management Materials
EMI, RFI and ESD Shielding MaterialsEMI, RFI and ESD Shielding and Protection
Flexible Circuit Adhesives and materialsFlex Circuit Materials
LED Manufacturing Adhesives and MaterialsLED Materials
MIL-PRF 883C Section 5011 Compliant materialsMIL-STD 883C 5011.4 Compliant Materials
NASA and ESA Qualified Adhesives and FilmsNASA Outgassing Compliant Materials
Optical and Optoelectronic MaterialsOptical and Optoelectronic Materials
Solar Panel Adhesives and Advanced MaterialsSolar Panel Materials
Underfill and Encapsulation MaterialsUnderfill and Encapsulation Materials