|AIT Product||Applications||Resistivity (ohm-cm)||Thermal Conductivity (W/m-°C)||CTE ppm/°C||Die-Shear (psi)||Cure Schedule (temp/time) Flow Characteristics (pressure)
||Smaller ceramic lids Plastic lids of any size Passes gross and fine leaks Good moisture barrier
||Induce flow during placement at >100°C/14psi, Full curing @150°C/5min. without pressure Ambient storable for 12 mos.
||Metal lids for EMI Shielding Outstanding moisture barrier Low Stress with Low Temp Curing
||Induce flow during placement at 80-100°C Full Curing 80-150°C with NO pressure Ambient storable for 12 mos.
||Larger Lids and Devices Outstanding moisture barrier TP7150 for use <160°C
||Ambient storable for 12 mos. Instant melt-bonding at >10psi >200°C