Lid-sealing Solutions for Optical, Thermal, EMI and Commercial Component and Module packaging

Lid-sealing Solutions for Optical, Thermal, EMI and Commercial Component and Module packaging

Lid Attach Dispensable Insulating and Conductive Adhesives

AIT engineered and designed several innovative lid-sealing solutions for optical, thermal, EMI and commercial component and module packaging with outstanding cost effectiveness. It is ideal for the MEMS and wafer level lid sealing applications. The following are some of the examples:

AI Technology produces one of the unique dispensable lid-seal adhesives that can be cured at relatively low temperature of 100-200°C and yet capable of withstanding operation temperature of beyond 300°C continuously. While not as perfect hermetic seals as metal and glass seal, the cured lid seals passed gross and fine leak tests for almost all commercial applications. It is ideal for CMOS and other optical imaging devices.

CMOS Devices 1. MC 7883 Insulating Paste Adhesive: 100% solid, insulating lid-seal that cured inline at temperature of 175-200°C in a few seconds. Low coefficient of expansion (CTE) of less than 20 ppm/°C with low moisture absorption of less than 0.5% at saturation for long-term device reliability under thermal and environmental stresses. High glass transition of 240°C and long-term molecular stability above 300°C to ensure both standard commercial and military applications of 85C and 150°C continuously. It also enables the special ultra high temperature operational as sensors and electronic devices in oil wells and other specialty environments.

2. MC 8880 paste adhesive: 100% solid, electrically conductive lid-seal that cured inline at temperature of 175-200°C in a few seconds. Low coefficient of expansion (CTE) of less than 25 ppm/°C with low moisture absorption of less than 0.5% at saturation for long-term device reliability under thermal and environmental stresses. High glass transition of 240°C and long-term molecular stability above 300°C to ensure both standard commercial and military applications of 85°C and 150°C continuously. It also enables the special ultra high temperature operational as sensors and electronic devices in oil wells and other specialty environments.

Solderable Ceramic, Glass and LCP Lids
Solderable Lids
Pre-Applied Adhesive Preforms
Lid
EMI Shielding Covers, Lids, and Caps without soldering
Different Lids

SNAP-LID® Adhesive Preform Pre-application

Patent pending low cost pre-application of adhesive preforms on plastic, ceramic, metal lids. Instant tacking-bonding for in-line processes for both thermoplastic and epoxy-based adhesives. AIT provides both pre-applications on your parts or provides complete solution with lids.

COOL-LID® Lid Attach to Combine with Thermal Management

A solution incorporating heat-spreading interface from a flip chip device and module to the lid cover is accomplished with an AI Technology adhesive that is pre-applied and provides for a rapid bonding lid attach.This new technology combined the now world-renown COOL-PAD™ interface solution for devices generating more than 100 watts within a square inch area along with the snap-curing adhesive preform combine to provide a winning solution for the majority of lid attachment applications. COOL-LID® is a special cost effective patent-pending process where pre-application of thermal interface material and lid-seal adhesive are used. Lids may be constructed of copper, aluminum, and ceramics. If thermal performance is not critical, even plastic caps can be used. The B-staged lid seal adhesive and interface pad are dry to the touch and are ambient storable for 12 months. Both the adhesive and interface material will tack onto a substrate and form an intimate thermal contact at 150°C in a matter of seconds with nominal pressure of 10 psi. Full cure is achieved without pressure at 150°C in less than 5 minutes.

LID-SEAL: Low Cost Sealing, Thermal & Shielding Solutions

Adhesive Preforms (Adhesive Film Pre-application for optical, component, and module lid sealing)

Patented pending low cost pre-application of adhesive on metal, ceramics, optical GLASS or LCP lids. Instant tacking-bonding for in-line processes for both thermoplastic and epoxy-based adhesives. AIT provides both pre-applications on your parts or provides complete solutions with optical lids. Passes fine and gross leaks and 85%RH/85C aging without fogging or change of bond strength.

AIT ProductApplicationsResistivity (ohm-cm)Thermal Conductivity (W/m-°C)CTE ppm/°CDie-Shear (psi)Cure Schedule (temp/time) Flow Characteristics (pressure)
ESP7675-HF Smaller ceramic lids Plastic lids of any size Passes gross and fine leaks Good moisture barrier >1x1014 1.2 40 >3,000 Induce flow during placement at >100°C/14psi, Full curing @150°C/5min. without pressure Ambient storable for 12 mos.
ESP8680-HF Metal lids for EMI Shielding Outstanding moisture barrier Low Stress with Low Temp Curing <5x10-4 >6.0 45 >2,000 Induce flow during placement at 80-100°C Full Curing 80-150°C with NO pressure Ambient storable for 12 mos.
TP7150 Larger Lids and Devices Outstanding moisture barrier TP7150 for use <160°C >1x1014 0.3 >1,200 Ambient storable for 12 mos. Instant melt-bonding at >10psi >200°C

Solderless EMI Shielding with Pre-application Adhesives

Low cost pre-application of instant melt-bondable conductive adhesive preforms to replace soldering onto PWB. Instant insertion bonding with shielding effectiveness with pre-applied pressure-sensitive. Optional in-situ curing for additional strength upon heating.Instant tacking-bonding for in-line processes for both thermoplastic-based conductive lid shielding and sealing adhesives. AIT will pre-apply adhesive on your parts or provide a complete solution with metal lids and covers.

AIT ProductApplicationsResistivity (ohm-cm)Thermal Conductivity (W/m-°C)CTE ppm/°CDie-Shear (psi)Cure Schedule (temp/time) Flow Characteristics (pressure)
CB8130 EMI Shielding Outstanding moisture barrier Ease of reworking Highest performance <5x10-4 >6.0 Flexible >1,000 Ambient storable for 12 mos. Instant melt-bonding at >150°C without pressure
CB8253-E EMI Shielding Outstanding moisture barrier Ease of reworking Lowest cost solution <5x10-3 >6.0 Flexible >1,000 Ambient storable for 12 mos. Pressure-sensitive with additional optional in-situ curing bonding at >150°C without pressure

CONTACT US FOR LID SEALING & PREFORM PRODUCT ADVICEPRICE QUOTE - email us at sales@epakelectronics.com
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ADHESIVES, EPOXIES AND FILMS AVAILABLE:

Automotive Electronics Adhesives and Thermal Interface MaterialsAutomotive Electronic & Electrical Adhesives
Coatings & Protection MaterialsCoatings & Protection
High Performance CPU and GPU Cooling ApplicationsCPU Cooling - COOL-SILVER™
Custom Adhesives, Epoxies, Pastes and Film MaterialsCustom Material Solutions
Dicing, Lapping and Grinding TapesDicing, Lapping and Grinding Tapes
Die Attach Pastes, Adhesive and Film MaterialsDie, Substrate and Component Attach Materials
Lid Seal Solutions and PreformsLid Seal Solutions
Thermal Management Materials, Gels, Greases and FilmsThermal Management Materials
EMI, RFI and ESD Shielding MaterialsEMI, RFI and ESD Shielding and Protection
Flexible Circuit Adhesives and materialsFlex Circuit Materials
LED Manufacturing Adhesives and MaterialsLED Materials
MIL-PRF 883C Section 5011 Compliant materialsMIL-STD 883C 5011.4 Compliant Materials
NASA and ESA Qualified Adhesives and FilmsNASA Outgassing Compliant Materials
Optical and Optoelectronic MaterialsOptical and Optoelectronic Materials
Solar Panel Adhesives and Advanced MaterialsSolar Panel Materials
Underfill and Encapsulation MaterialsUnderfill and Encapsulation Materials