MIL-PRF883C Method 5011 Compliant Adhesives, Epoxies and Films

MIL-PRF883C Method 5011 Adhesives Epoxies and Films

Many AiT products are available to Mil Std 883D as well as NASA & ESA outgassing qualification standards. Materials can be supplied in one or two part components, syringe, in pre-formed films, sheets in various sizes and in jars.

MIL-STD 883C METHOD 5011.4 QUALIFIED ADHESIVE PRODUCTS

Test Procedures: Mil-Std 883C Method 5011.4
Test Conditions: Per Specification
Tests Performed: 1989 to 1996
Acceptability: Both material characteristics and system level performances must meet requirements

(Click on the Product for the TDS.)

AIT Product

Characteristics

Electrical Resistivity
(ohm-cm)

Thermal
Conductivity

(watt/m-oC)

Die-shear

Tg (oC)

Flexible
Ambient storage
dry epoxy film
>1x1014
size="1">>1.7
>2,000
>-60
 1-component flexible
epoxy paste
>1x1014
>1.7
>1,000
-25
1-component flexible
epoxy paste
>1x1014 
 >1.7 >1,000  -25 
1-component flexible
epoxy paste
Diamond filled
>1x1014
>11.4
>1,000
-25
1-component rigid
epoxy paste
<5x10-4
>7.9
>2,000
130
1-component flexible
epoxy paste
<4x10-4
>7.9
>1,000
-20
1-component flexible
epoxy paste
<5x10-4
>5.7
>1,800
-25
1-component flexible
epoxy paste
 <4x10-4  >7.9   -20 
Tacky epoxy film
<5x10-4 
>6.4 
>2,400 
-25 
Dry thermoplastic film
<4x10-4 
>6.4 
 >900
-70 
Dry thermoplastic film
<4x10-4  
>6.4 
   >900 
-70 

CONTACT US FOR MIL-STD 883C METHOD 5011.4 QUALIFIED ADHESIVE PRODUCTS SELECTIONPRICE QUOTE - email us at sales@epakelectronics.com

ADHESIVES, EPOXIES AND FILMS AVAILABLE:

Automotive Electronics Adhesives and Thermal Interface MaterialsAutomotive Electronic & Electrical Adhesives
Coatings & Protection MaterialsCoatings & Protection
High Performance CPU and GPU Cooling ApplicationsCPU Cooling - COOL-SILVER™
Custom Adhesives, Epoxies, Pastes and Film MaterialsCustom Material Solutions
Dicing, Lapping and Grinding TapesDicing, Lapping and Grinding Tapes
Die Attach Pastes, Adhesive and Film MaterialsDie, Substrate and Component Attach Materials
Lid Seal Solutions and PreformsLid Seal Solutions
Thermal Management Materials, Gels, Greases and FilmsThermal Management Materials
EMI, RFI and ESD Shielding MaterialsEMI, RFI and ESD Shielding and Protection
Flexible Circuit Adhesives and materialsFlex Circuit Materials
LED Manufacturing Adhesives and MaterialsLED Materials
MIL-PRF 883C Section 5011 Compliant materialsMIL-STD 883C 5011.4 Compliant Materials
NASA and ESA Qualified Adhesives and FilmsNASA Outgassing Compliant Materials
Optical and Optoelectronic MaterialsOptical and Optoelectronic Materials
Solar Panel Adhesives and Advanced MaterialsSolar Panel Materials
Underfill and Encapsulation MaterialsUnderfill and Encapsulation Materials