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MIL-STD 883C 5011.4 Compliant
MIL-STD
883C METHOD 5011.4 QUALIFIED ADHESIVE PRODUCTS
Test Procedures: Mil-Std
883C Method 5011.4
Test Conditions: Per Specification
Tests Performed: 1989 to 1996
Acceptability: Both material characteristics and
system level performances must meet requirements
(Click
on the Product for the TDS.)
|
AIT
Product
|
Characteristics
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Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity(watt/m-oC)
|
Die-shear
|
Tg (oC)
|
|
|
Flexible
Ambient storage
dry epoxy film
|
>1x1014
|
>1.7
|
>2,000
|
-60
|
|
|
1-component flexible
epoxy paste
|
>1x1014
|
>1.7
|
>1,000
|
-25
|
|
|
1-component
flexible
epoxy paste |
>1x1014
|
>1.7 |
>1,000 |
-25 |
|
|
1-component flexible
epoxy paste
Diamond filled
|
>1x1014
|
>11.4
|
>1,000
|
-25
|
|
|
1-component rigid
epoxy paste
|
<5x10-4
|
>7.9
|
>2,000
|
130
|
|
|
1-component flexible
epoxy paste
|
<4x10-4
|
>7.9
|
>1,000
|
-20
|
|
|
1-component flexible
epoxy paste
|
<5x10-4
|
>5.7
|
>1,800
|
-25
|
|
|
1-component flexible
epoxy paste
|
<4x10-4 |
>7.9 |
|
-20 |
|
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Tacky epoxy film
|
<5x10-4
|
>6.4
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>2,400
|
-25
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|
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Dry thermoplastic film
|
|
>6.4
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>900
|
-70
|
|
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Dry thermoplastic film
|
|
>6.4
|
>900
|
-70
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18/09/2008 07:34
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Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film
& Thick Film Resistors - Electronic Packages - Dispensing
Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape &
Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV
Curing Systems & Accessories - Solderability Test Equipment -
Steam Agers - Custom Machine Guarding
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