COOL-SILVER TM

COOL-SILVER™
BEATS THE BEST OF THE KNOWN THERMAL GREASES IN SIDE-BY-SIDE TESTING BY
OVER-CLOCKING COMPUTER COMMUNITY
Since the
introduction of “COOL-SILVER™” thermal grease of AI Technology, Inc. to
the over-clocking computing community, in less than two months, it has gained
the best thermal interface material recognition among the computer
enthusiasts in the over-clocking gaming community.
In Legit review
(http://legitreviews.com/article/577/1/):
“I think it would be advantageous of the guys/gals running stock
coolers to get a tube of Cool Silver and set aside 15-20 minutes of their day
to change over. I also think the HTPC crowd could take advantage of Cool
Silver to help them in their goal for a cool quite machine.”
This
recommendation is made based on the finding of as much as 4°C lower
temperature when “COOL-SILVER™” is used with a standard heat sink that
come with the Intel processor. “First, we will look at the stock Intel
heatsink. As you can see in the charts, Cool Silver wins out over the Arctic
Silver 5 by 4 degrees at idle and 2 degrees at full load.”
In TWEAKNEWS
review (http://www.tweaknews.net/reviews/ai_technology_cool_silver/): “Well,
AIT's claims seem to be justified, although barely. The Cool Silver performs
a bit better at idle, while it bests AS5 by 4C at load with the XP-90 cooler.
Keep in mind that the results are subject to the accuracy of the monitoring
program and the sensors themselves, but I'm declaring The Cool Silver a
winner by virtue of the load performance.”
“COOL-SILVER™”
is one of the hundreds of thermal interface materials made by AI Technology,
Inc. (AIT) that have leading edge performance over the last twenty five years
in military and commercial electronics.
Even though
“COOL-SILVER” greases is loaded with pure silver, they have been
intentionally engineered to be non-conductive electrically under normal
applications intended. If a pure dielectric thermal interface material is a
requirement in your application, similar performance to ‘”COOL-SILVER”
are available in non-silver based dielectric thermal COOL-GREASE® CGR-8.
With similar thermal resistance performance, in side-by-side measurement, it
still beats the same best competitive products by the same 2-4°C.
In fact, in the
internal side-by-side testing among the best thermal interface materials made
by AIT there are several other types of its products that have even lower
thermal interface resistance to achieve even faster heat dissipation and
lower the temperature by at least another 2-4°C. Among them is the
COOL-SILVER™ CPCM is the patented compressible phase-change material (CPCM)
version of COOL-SILVER™ grease. That is, COOL-SILVER™ CPCM may cool your
computer by as much as 4-8°C in over-clocking applications.
For those
requiring electrical conductive version of the same thermal interface
material, AIT offers the analog versions in its COOL-GREASE® and COOL-PAD™
series of products. (Please contact us for recommendations or information)
COOL-SILVERTM
thermal gel-grease
 


The bench-mark thermal performance measured
illustrated above demonstrated more than 2-3 temperature centigrade lower
junction temperatures over the industry "standards" even for a
medium performing CPS for longer life of the processors and electronic
devices. Higher performing electronic device will be able to extract even
more reliability results with the use of this innovative thermal interface
materials.
AIT offers one of the most
comprehensive thermal greases and thermal gels with the lowest thermal
resistance ever documented. The following tables represent some of these
innovative interface material solutions and advantages:
·
The lowest
thermal interface resistance greases and gels ever documented
·
All
non-silicone based and non-migrating designed for delicate electronics
·
In-situ
curing thermal interface gels are first in the industry
·
Available
as electrically conductive or electrically insulating versions.

The bench-mark thermal performance
measured for an AIT non-silver based thermal interface gel (COOL-GEL®)
illustrated above demonstrated more than 1 temperature centigrade lower
junction temperatures over the industry "standards" of silver-based
products even for a medium performing CPS for longer life of the processors
and electronic devices. Higher performing electronic device will be able to
extract even more reliability results with the use of this innovative thermal
interface materials.
Thermal Gels and Grease
(Click
on the Product for the TDS)
|
AIT Product
|
Characteristics
|
Electrical Resistivity
(ohm-cm)
|
Thermal Conductivity(watt/m-oC)
|
Dielectric
Strength
(volt/mil)
|
Die-shear (psi)
|
Tg (oC)
|
|
|
-Non-silicone thermal grease
|
>1x1014
|
>2.0
|
N/A
|
N/A
|
Grease
|
|
|
-Non-silicone thermal grease
|
>1x1014
|
>4.0
|
N/A
|
N/A
|
Grease
|
|
|
-Non-silicone thermal grease
|
>1x1014
|
>4.0
|
N/A
|
N/A
|
Grease
|
|
|
-Non-silicone thermal gel
|
>1x1014
|
>5.7
|
300 |
<300
|
-60
|
|
|
-Interface/Potting gel
|
>1x1014
|
>4.1
|
500
|
<300
|
-65
|
|
|
-Non-silicone thermal grease
|
<1x10-4
|
>8.6
|
N/A
|
<300
|
Gel
|
|
|
-Thermal potting gel
|
<1x10-2
|
>8.3
|
N/A
|
<300
|
Gel
|
|
COOL-SILVERTM
|
-Lowest thermal resistance
-Non-silicone thermal grease
|
Non-conductive |
>16
|
N/A
|
N/A
|
Grease |
AIT offers many other gels, greases, and other thermal interface materials
not shown on our web site. Please go to Product
Application Form to receive a recommendation from our
office on your specific application.
|