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COOL-SILVER ^TM

COOL-SILVER™ BEATS THE BEST OF THE KNOWN THERMAL GREASES IN SIDE-BY-SIDE TESTING BY OVER-CLOCKING COMPUTER COMMUNITY

Since the introduction of “COOL-SILVER™” thermal grease of AI Technology, Inc. to the over-clocking computing community, in less than two months, it has gained the best thermal interface material recognition among the computer enthusiasts in the over-clocking gaming community.

In Legit review (http://legitreviews.com/article/577/1/): “I think it would be advantageous of the guys/gals running stock coolers to get a tube of Cool Silver and set aside 15-20 minutes of their day to change over. I also think the HTPC crowd could take advantage of Cool Silver to help them in their goal for a cool quite machine.”

This recommendation is made based on the finding of as much as 4°C lower temperature when “COOL-SILVER™” is used with a standard heat sink that come with the Intel processor. “First, we will look at the stock Intel heatsink. As you can see in the charts, Cool Silver wins out over the Arctic Silver 5 by 4 degrees at idle and 2 degrees at full load.”

In TWEAKNEWS review (http://www.tweaknews.net/reviews/ai_technology_cool_silver/): “Well, AIT's claims seem to be justified, although barely. The Cool Silver performs a bit better at idle, while it bests AS5 by 4C at load with the XP-90 cooler. Keep in mind that the results are subject to the accuracy of the monitoring program and the sensors themselves, but I'm declaring The Cool Silver a winner by virtue of the load performance.”

“COOL-SILVER™” is one of the hundreds of thermal interface materials made by AI Technology, Inc. (AIT) that have leading edge performance over the last twenty five years in military and commercial electronics.

Even though “COOL-SILVER” greases is loaded with pure silver, they have been intentionally engineered to be non-conductive electrically under normal applications intended. If a pure dielectric thermal interface material is a requirement in your application, similar performance to ‘”COOL-SILVER” are available in non-silver based dielectric thermal COOL-GREASE® CGR-8. With similar thermal resistance performance, in side-by-side measurement, it still beats the same best competitive products by the same 2-4°C.

In fact, in the internal side-by-side testing among the best thermal interface materials made by AIT there are several other types of its products that have even lower thermal interface resistance to achieve even faster heat dissipation and lower the temperature by at least another 2-4°C. Among them is the COOL-SILVER™ CPCM is the patented compressible phase-change material (CPCM) version of COOL-SILVER™ grease. That is, COOL-SILVER™ CPCM may cool your computer by as much as 4-8°C in over-clocking applications.

For those requiring electrical conductive version of the same thermal interface material, AIT offers the analog versions in its COOL-GREASE® and COOL-PAD™ series of products. (Please contact us for recommendations or information)

COOL-SILVER^TM thermal gel-grease

The bench-mark thermal performance measured illustrated above demonstrated more than 2-3 temperature centigrade lower junction temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.

AIT offers one of the most comprehensive thermal greases and thermal gels with the lowest thermal resistance ever documented. The following tables represent some of these innovative interface material solutions and advantages:

· The lowest thermal interface resistance greases and gels ever documented

· All non-silicone based and non-migrating designed for delicate electronics

· In-situ curing thermal interface gels are first in the industry

· Available as electrically conductive or electrically insulating versions.

The bench-mark thermal performance measured for an AIT non-silver based thermal interface gel (COOL-GEL^®) illustrated above demonstrated more than 1 temperature centigrade lower junction temperatures over the industry "standards" of silver-based products even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.

Thermal Gels and Grease

(Click on the Product for the TDS)

AIT Product	Characteristics	Electrical Resistivity (ohm-cm)	Thermal Conductivity (watt/m-^oC)	Dielectric Strength (volt/mil)	Die-shear (psi)	Tg (^oC)
COOL-GREASE^® CGR7015	-Non-silicone thermal grease	>1x10¹⁴	>2.0	N/A	N/A	Grease
COOL-GREASE^® CGR7016	-Non-silicone thermal grease	>1x10¹⁴	>4.0	N/A	N/A	Grease
COOL-GREASE^® CGR7018	-Non-silicone thermal grease	>1x10¹⁴	>4.0	N/A	N/A	Grease
COOL-GEL^® CGL7019	-Non-silicone thermal gel	>1x10¹⁴	>5.7	300	<300	-60
COOL-GEL^® CGL7056-XT	-Interface/Potting gel	>1x10¹⁴	>4.1	500	<300	-65
COOL-GEL^{^®}CGL8050	-Non-silicone thermal grease	<1x10^-4	>8.6	N/A	<300	Gel
COOL-GEL^® CGL8503	-Thermal potting gel	<1x10^-2	>8.3	N/A	<300	Gel
COOL-SILVER^TM	-Lowest thermal resistance -Non-silicone thermal grease	Non-conductive	>16	N/A	N/A	Grease

AIT offers many other gels, greases, and other thermal interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.

09/03/2010 16:03

Latest News:

09.03.2010

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

14.01.2010 Southern Manufacturing Show. Epak Electronics Will be exhibiting at Southern Manufacturing in Farnborough 10th & 11th February 2010.

#500 Exhibitors

# FREE Tickets (when pre-booked)

# FREE Parking

# FREE Seminars

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers.

16.04.09 Comco to Exhibit at InterSolar Munich

Comco Inc. will exhibit micro-abrasive blasting equipment at the InterSolar Munich show, May 27-29, 2009, New Trade Fair Center, Munich, Germany booth A3.208.

11.01.09

27.10.08 SPT RTR-D2/D3 series pickup tips for thin or fragile components

14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles.

18.04.08 NEW from AI Technology : COOL-SILVER^{TM CPU
Thermal Grease gives 2-3
degree centigrade lower temperatures over the industry
"standards" even for a medium performing CPS for longer life
of the processors and electronic devices.}

19.03.08 : New Website Launched

COOL-SILVER TM

COOL-SILVER ^TM