Thermal Gels
and Grease
(Click
on the Product for the TDS)
|
AIT
Product
|
Characteristics
|
Electrical
Resistivity
(ohm-cm)
|
Thermal
Conductivity(watt/m-oC)
|
Dielectric
Strength
(volt/mil)
|
Die-shear
(psi)
|
Tg
(oC)
|
|
|
-Non-silicone
thermal grease
|
>1x1014
|
>2.0
|
N/A
|
N/A
|
Grease
|
|
|
-Non-silicone
thermal grease
|
>1x1014
|
>4.0
|
N/A
|
N/A
|
Grease
|
|
|
-Non-silicone
thermal grease
|
>1x1014
|
>4.0
|
N/A
|
N/A
|
Grease
|
|
|
-Non-silicone
thermal gel
|
>1x1014
|
>5.7
|
300 |
<300
|
-60
|
|
|
-Interface/Potting
gel
|
>1x1014
|
>4.1
|
500
|
<300
|
-65
|
|
|
-Non-silicone
thermal grease
|
<1x10-4
|
>8.6
|
N/A
|
<300
|
Gel
|
|
|
-Thermal potting
gel
|
<1x10-2
|
>8.3
|
N/A
|
<300
|
Gel
|
|
COOL-SILVERTM
|
-Lowest thermal resistance
-Non-silicone thermal grease
|
Non-conductive |
>16
|
N/A
|
N/A
|
Grease |
AIT offers many other gels, greases, and other
thermal interface materials not shown on our web
site. Please go to Product
Application Form to receive a
recommendation from our office on your specific
application.



The bench-mark thermal
performance measured illustrated above demonstrated more
than 2-3 temperature centigrade lower junction
temperatures over the industry "standards"
even for a medium performing CPS for longer life of the
processors and electronic devices. Higher performing
electronic device will be able to extract even more
reliability results with the use of this innovative
thermal interface materials.
AIT
offers one of the most comprehensive thermal greases and
thermal gels with the lowest thermal resistance ever
documented. The following tables represent some of these
innovative interface material solutions and advantages:
·
The
lowest thermal interface resistance greases and gels
ever documented
·
All
non-silicone based and non-migrating designed for
delicate electronics
·
In-situ
curing thermal interface gels are first in the industry
·
Available
as electrically conductive or electrically insulating
versions.

The bench-mark
thermal performance measured for an AIT non-silver based
thermal interface gel (COOL-GEL®)
illustrated above demonstrated more than 1 temperature
centigrade lower junction temperatures over the industry
"standards" of silver-based products even for
a medium performing CPS for longer life of the
processors and electronic devices. Higher performing
electronic device will be able to extract even more
reliability results with the use of this innovative
thermal interface materials.