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AIT Product	Characteristics	Electrical Resistivity    (ohm-cm)	Thermal Conductivity (watt/m-oC)	Dielectric Strength (volt/mil)	Die-shear (psi)	Tg  (oC)
COOL-GREASE® CGR7015	-Non-silicone thermal grease	>1x1014	>2.0	N/A	N/A	Grease
COOL-GREASE® CGR7016	-Non-silicone thermal grease	>1x1014	>4.0	N/A	N/A	Grease
COOL-GREASE® CGR7018	-Non-silicone thermal grease	>1x1014	>4.0	N/A	N/A	Grease
COOL-GEL® CGL7019	-Non-silicone thermal gel	>1x1014	>5.7	300	<300	-60
COOL-GEL® CGL7056-XT	-Interface/Potting gel	>1x1014	>4.1	500	<300	-65
COOL-GEL® CGL8050	-Non-silicone thermal grease	<1x10-4	>8.6	N/A	<300	Gel
COOL-GEL® CGL8503	-Thermal potting gel	<1x10-2	>8.3	N/A	<300	Gel
COOL-SILVERTM	-Lowest thermal resistance -Non-silicone thermal grease	Non-conductive	>16	N/A	N/A	Grease

AIT offers many other gels, greases, and other thermal interface materials not shown on our web site. Please go to Product Application Form to receive a recommendation from our office on your specific application.  

 

 

The bench-mark thermal performance measured illustrated above demonstrated more than 2-3 temperature centigrade lower junction temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.

 

 

AIT offers one of the most comprehensive thermal greases and thermal gels with the lowest thermal resistance ever documented. The following tables represent some of these innovative interface material solutions and advantages:

 

• The lowest thermal interface resistance greases and gels ever documented

• All non-silicone based and non-migrating designed for delicate electronics

• In-situ curing thermal interface gels are first in the industry

• Available as electrically conductive or electrically insulating versions.

 

 

The bench-mark thermal performance measured for an AIT non-silver based thermal interface gel (COOL-GEL^®) illustrated above demonstrated more than 1 temperature centigrade lower junction temperatures over the industry "standards" of silver-based products even for a medium performing CPS for longer life of the processors and electronic devices. Higher performing electronic device will be able to extract even more reliability results with the use of this innovative thermal interface materials.