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09.08.2010

YouTube Channel Online. We have uploaded videos of the Epak BV9000 wafer beveller and opened a YouTube Channel to show and demonstrate our equipment. The first of these shows the functions and features of the BV9000 beveller. More will be added soon.

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters since their beginning. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years. As well as having sold almost every type of equipment offered by Comco in the last 40 years we have recently begun custom automation solutions where an off the shelf system is not available. See our Custom Products page for further details of what we can offer

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now. MORE DETAILS HERE

09.03.2010 Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

Giving an overview in some of the uses for micro-abrasive technology for applications such as Stent Processing, Wafer Drilling & Machining, Coating Removal and Surface Preparation and Wafer Bevelling.

14.01.2010 Epak Electronics Exhibiting at the Southern Manufacturing Show. in Farnborough 10th & 11th February 2010.

Visit us on stand 347 Five, Farnborough, Hants.

Free tickets are available by pre-registering at www.industrysouth.co.uk

There is free parking and free conferences available.

More details of the show including directions and an exhibitor list can be found here

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

We have just manufactured & supplied a custom blast cabinet for use with a Comco AF10 Accuflo. Our customer needed to clean some quite large fossils for which the Comco microblaster is perfectly suited due to its controllability on delicate parts.

Click here fore more details

18.09.09 Epak BV9000 Wafer Beveller Installed

Epak Electronics have completed and installed our latest custom project for a BV9000 wafer beveller. Our customer already had two 25 year old Comco BV8003 wafer bevellers but needed to scale up the size capability. Epak have manufactured the new machine and used our expertise in abrasives to create a robust and easy to use machine capable of handling wafers from 30mm to 150mm in size.

Click here for more details:

16.04.09 Comco to Exhibit at InterSolar Munich

Comco Inc. will exhibit micro-abrasive blasting equipment at the InterSolar Munich show, May 27-29, 2009, New Trade Fair Center, Munich, Germany booth A3.208. Nick Blamey from Epak will be on the booth at the show and visitors will have the opportunity to see how micro-abrasive blasting is used to texture wafers.

Micro-abrasive blasting is a technology that uses micro-sized particles of high grade abrasives propelled out of a small nozzle tip at high velocity to clean, cut, deburr, and texture a variety of surfaces. This technology offers the accuracy and control needed to effectively process small parts providing solutions for the solar industry.

Fast and consistent results can be obtained with manual or semi-automated micro-abrasive blasting solutions. Comco’s Applications Lab welcomes sample parts for testing to determine the most efficient method. Find out more about micro-abrasive blasting and sample parts testing at InterSolar Munich booth A3.208.

To find out more about InterSolar Munich and to register for the show, visit the official InterSolar Munich website.

11.01.09 Epak will be exhibiting at MEDTEC UK on 25th and 26th March 2009.

Please join us on stand 1801 at the MEDTEC UK trade fair 25-26 March 2009 at the NEC in Birmingham, UK. Register by 27 February to receive your badge by post.

We look forward to seeing you in Birmingham, 25-26 March 2009.
To register, please visit http://www.devicelink.com/expo/mdt09/

27.10.08 SPT RTR-D2/D3 series pickup tips for thin or fragile components.

For some applications, like handling large thin die, the preferred vacuum cavity is different than the traditional round or rectangular shape found on common rubber tips. The desired design is rather a cross groove or X sign or a multi hole configuration. This feature prevents the die to warp inside the vacuum cavity and to cause poor wetting or incomplete epoxy coverage during die placement. The outer shape of the tip depends on the size of TL/TW:2 or 4 tapered walls or vertical walls. Various custom vacuum channel or cavity configurations are possible on request.

14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles.

Philtec Diamond Wheel Dressing Solution & Safe-T-Stain For Delineating Doped L:ayers In Silicon

The Safe-T-Stain consists primarily of metal salts, in an electrolyte which have been used extensively to stain the more n-type regions on the silicon wafer. This characteristic holds consistent with the p on p+ being darkened. Repeatable results are achieved by control of light intensity and staining time. Five compositions are available to permit selection of the most appropriate stain.

Overstained regions often require no refinishing; they are merely wiped with a dampener paper towel and re-stained. The chemical composition of this stain does not necessitate extraordinary safety precautions during it's use. Minimal experience and technique are needed to stain junctions with Philtec Safe-T-Stain, because a unique stain composition is available for most junction impurity concentration ranges.

UV FastCheck™ Strips are simple, reliable, and easy to use indicators of accumulated UV light dosage. They are the first product that can be used to determine levels of UV dose with a simple, visual inspection due to the 5 separate color changing zones. Each of the 5 zones begin to change color after a specific amount of UV dose has been received. First the "1" zone begins turning from yellow to blue. Then each subsequent color zone starts to change colors when its specific chemistry has received the proper amount of UV to activate its color change.

The versatility of this unique UV measurement tool allows users to measure a significant range of UV doses. FastCheck Strips measure UV doses from 0mJ/cm² to greater than 5,000mJ(5J)/cm². As well, due to their paper-thin profile and thermal stability, they can be used in all applications where a radiometer is not possible, including: Web printing, Sheet Fed printing, Exposure Verification of exposed products, 3-D curing, and personal UV exposure level testing.

The FastCheck Strips' clearly identifiable color change enables users to visually differentiate the dose differences. UV FastCheck Strips can be further coupled with a handheld colorimeter to measure the dose even more precisely.

As well, we have prepared a comparative dose chart for the FastCheck Strips (N010-003) so that each tested FastCheck Strip can be correlated to the millijoules of UV energy that each color pattern represents. NOTE: This chart is comprised of actual exposed FastCheck Strips.

Made from the same exclusive material, the New UV Intensity Labels (N010-005) have the same color changing principle as the Strips, but they have only 1 color changing square. Click here for more information.

FEATURES:
• FastCheck Strips measure the entire UV spectrum
• Accurate visual determination of UV dose made possible
• Monitor UV dose in difficult-to-access curing environments
• Detect UV lamp degradation and equipment failures
• Provide the user with periodic assurance that their UV source is performing to expectations
• Greater rate of color change provides clearer, more precise UV dose determination
• Determine the dose profile in the 3D curing chambers or across wide webs to ensure even cure
• Measure the dose of sunlight in outdoor curing applications
• Evaluate and compare multiple UV light sources

SPECIFICATIONS:
• UV FastCheck Strips are available in packages 200 Strips (10 sheets of 20 adhesive backed Strips per sheet)
• UV FastCheck Strips Dimensions: 1/2”H x 2-1/8”W (13mm x 54mm)

Model 360 UV Exposure System (13.09.05)

Revolutionary new design cures UV tapes quickly and uniformly, features an ultra long life light source and handles all size wafers up to 300mm.

The Model 360 UV exposure system needs no external ventilation and has a small 18” diameter footprint.

Model 360 Capabilities:

Cures most UV tape in 30 seconds
Digital timer counts down and gives audible signal when cycle is complete
Has cover gas capability with purge timer
Gas flow stops at end of cycle
Light source has uniform output over 10,000 hours of operation
Generates very little heat and no ozone
Easy to operate. Virtually no training required
No set-up required when changing wafer sizes

TFC9000 THIN FILM CALORIMETER - QUALIFY YOUR INKS, COATINGS & ADHESIVES (13.09.05)

Is it the Inks or is it the Lamps? Know for Sure with the Thin Film Calorimeter.

You need a radiometer to ensure the performance and curing effectiveness of your UV lamps. So, how do you ensure the same of your inks, coatings and adhesives? Up until now, it was mostly guesswork. If you had curing problems and had ruled out your UV lamps as the culprit, your next target was most likely your chemistry. CON-TROL-CURE’s Thin Film Calorimeter (TFC) allows you to quantitatively measure the curability of your inks, coatings and adhesives.

The TFC-9000™ qualifies your inks, coatings and adhesives curability and ensures that they are curing consistently, batch-to-batch. Now you can test the shelf life of stored inks and evaluate older inks to know conclusively if they still perform to your expectations. Less wasted material translates into greater savings and profits.

The TFC-9000 measures the exothermic heat reaction from a polymerizing sample through a highly sensitive sensor. It performs a rapid analysis of the incoming data to produce meaningful results. Once the green "start" button is selected, the curing and evaluation process commences:
• Temperature recording starts
• The UV LED lamp automatically turns on
• The sample is cured
• Peak temperature reaction from the cured sample is reached and displayed
• Once the temperature reaches 75% of the peak, the lamp automatically shuts off

Upon successful test completion, the TFC-9000 displays key measured test results as indicated in the LCD displays:

• Heat Flux
• Peak Value of Heat (in BTU’s)
• Total Test Time
• Slope of the Curve for "Time to Peak" vs. "Heat Generated"
• Current Temperature
• Total Heat (in BTU’s/Hour)

The TFC-9000 works as a stand-alone measurement system or can be connected to a computer through a serial port. The captured data can be exported and plotted to an Excel graph for quick and easy analysis.

Note: The system is sold complete with the UV LED lamp. If a different UV source is required, various UV lamp options are available for use with the TFC-9000 system.

SPECIFICATIONS:
Dimensions: 12”W x 11.25”L x 6.25”H (30.5 cm x 28.6 cm x 15.9cm)
System Weight: 14.5 lbs (2.83 kg)
Sensor Resistance: 300 Ohms (Approx.)
Sensor Lead Wires: 10’ (3.1m) Solid copper, teflon insulated
Nominal Sensitivity: 3.0 µV/Btu/Ft²-Hr
Max Rec’d Heat Flux: 30,000 Btu/Ft²Hr
Response Time: 0.6 sec
Temperature Limit: 400°F (205°C)
Thermal Capacitance:0.03 Btu per Ft²-°F
Thermal Resistance: 0.01 °F per Btu/Ft²-Hr

NEW P.I. CAPILLARY FROM SPT (13.09.05)

The advancement in bonding technology and the market demand for faster, smaller and better product, again poses new challenges for the wire bonding process. The transition from fine-pitch (FP) to ultra fine-pitch (UFP) volume production, and the emergence of stacked die, multi-tier and low-K bonding has increased the level of difficulties in the wire bonding process with more yield loss due to lifted ball, wire shorts, etc.

In compliance with these new bonding requirements, SPT has embarked on an extensive study to develop a new generation and high-performance capillary. Designed with advanced process diagnostic tools, the new capillary design, known as the PI (Programmed Intelligence) capillary has been extensively tested in a variety of wire bonders and packages. In all tests, the PI capillary has demonstrated superior bonding performance with good repeatability and portability using a wide range of bonding platform.

Programmed Intelligence P.I. Capillary

The PI capillary was derived from a series of physical modeling and finite element analysis (FEA) studies to analyze the stress level at the tip and transition profile for different designs, as these are locations where breakage is most likely to occurs. An example of the analysis – in this case, for the PI design is as shown below. Among the options considered, the PI design showed the lowest overall stress. This result was validated through destructive test, which showed that the breaking load for the PI design is 7% higher as compared to other design option.

	Data Source	Design A	Design B	PI Design
Stress @ Transition (x109 Pa)	Simulation	0.6632	0.5687	0.5417
Stress @ Tip (x1011 Pa)	Simulation	0.1269	0.1253	0.1167
Breakage load (gf)	Simulation	228	238	245

Figure 1: Correlation of the simulation data with the results of destructive test

Laser interferometry technique is also used to determine the optimum capillary profile through amplitude of vibration measurement along the overall profile of the capillary. In wire bonding, the vibration characteristics of the capillary is an important factor as its indicates the efficiency of the transfer of the ultrasonic energy from the bonding tool to the bond pad interface. Through the various design optimization, the PI design has shown to be more responsive to the bonding parameters, producing better bond integrity.

Amplitude of Vibration (nm)
Design A	Design B	PI Design
454	488	544

Figure 2: Laser interferometry test results

Based on the various simulation and diagnosis, the PI capillary design was conceived. Actual bonding responses were tested using standard QFP and BGA package for a 70um bond pad pitch (BPP). The PI capillary was shown to be more responsive to the bonding parameter producing better results on all the measures (ball size, ball shear and stitch pull). In contrast, other design options would require higher bond force and more ultrasonic power to achieve the same bond integrity. This observation correlated with the result from the laser interferometry test.

	Readings	Design A	Design B	PI Design
Ball size (um)	25	52.6	53.3	53.8
Ball shear (gf) Standard deviation Failure mode	25	24.4 1.41 Ball sheared	25.0 1.48 Ball sheared	25.7 1.33 Ball sheared
Stitch pull (gf) Standard deviation Failure mode	25	7.32 100% Break @ stitch	7.41 100% Break @ stitch	7.54 100% Break @ stitch

Figure 3: Average results from actual bonding responses

Today, the PI capillary has been qualified and used in volume production by major assembly houses for a broad range of bonding applications. Depending on the specific bonding application, the PI design can be used together with the any existing design feature, such as the DFX (for small ball large wire bonding), CSP (for short loop/low wire bonding, BSB (ball stitch on ball bonding), Infinity (extended tool life), etc. Indeed, the PI capillary has proved to be a new revolution in bonding solution.

Click here to review the various bonding application and part number recommendations applicable with the PI capillary

CONSTANT AIR BLEED OPTION NOW AVAILABLE ON
ALL COMCO MICRO-ABRASIVE BLASTERS (13.09.05)

Consistent operation of the MicroBlaster requires very clean, dry compressed air. This can be easily achieved with the proper dryer installed on the air line. A more difficult task is controlling

the environment where the blasting occurs. Often it can be very wet and dirty, as in the case of hypodermic needle production facilities. To keep the contamination from clogging the nozzles we have developed a Constant Air Bleed Option.

The constant air option functions alternately with the pinch valve. When the machine is turned on clean air immediately begins flowing to the nozzle. As soon as the abrasive stream is activated the bleed turns off. The constant flow of air out to the nozzle keeps contamination from plugging into the nozzle and restricting the abrasive flow.

For more information about the Constant Air Bleed Option, call us today.

Learn about integrating micro-abrasive blasting with needle grinding from John Perry of Popper Precision Instruments in this month's MPMN on-line at:

http://www.devicelink.com/mpmn/archive/05/07/016.html .

REPAIR & REFURBISHMENT (26/04/05)

Its not a new service we offer but for our new and old customers we can carry out inspection, repair and refurbishment for all the Comco machines at our headquarters in Chard, Somerset. Depending on the nature of the problem and parts needed we will carry out a thorough inspection and advise you of the condition of the essential parts for the machines operation. Before proceeding with any work we will consult you and request authorization to carry out work or return the machine with only a nominal inspection fee. We always endeavor to get machines repaired and turned around as quickly as possible.

Refurbishment is possible for machines that at first look beyond repair. The MB100 below has had a hard working life but despite the initial cosmetic condition which is the worst one we have seen to date, mechanically it was in relatively good condition. With a little TLC,a few hours labor, some paint and some spare parts we managed to transform the machine into one almost as good as new and it is now back in regular use at our customers site. Yes, it is actually the same machine.

BEFORE AFTER

A broken footswitch, snapped switches on the front, worn hoses, broken fuse holder, loose tank and custom paint job ! Inside it took 20 mins with a hoover & brush to uncover what the internal parts were like.

Aproximately a day later, with new switches, a new gauge, hoses, mains cable, footswitch, a respray and new front fascia, its almost as good as new.

Yes, it is actually the same machine!

UV LED CURE-ALL (18/04/05)

This amazing new lamp can simply perform in ways that current lamps cannot. In order to truly maximize the potential of this lamp technology, you need to forget all of your current assumptions in regards to how UV curing works. This lamp technology defies accepted UV curing limitations. It is simply doing what it should not be allowed to do. It's curing faster. It's power consumption is minimal. The mechanism of cure is operating beyond current standards, due to the fact that this lamp is 100% efficient.

UV curing without heat!
Heat sensitive substrates (films, foils, DVDs, CDs, etc.)
UV curing without radiometers!
Consistent lamp output for the first 50,000 hours!
UV curing without replacement lamps!
Keep your line running - no downtime!

APPLICATIONS:
• Laminating Adhesive	• 3-D Curing	• Wire Marking
• Silicone Release Lining	• CD/DVD	• Wire Tacking
• Ink Jet	• Wood Repair/Finishing	• Contact Lenses
• Narrow Web Flexo	• Medical Assembly	• Heat Sensitive Substrate Curing

New Epak 2005 CD-ROM Catalogue (18/04/05)

The latest update of the Epak Electronics CD Catalogue is now available. It features all of our product range, including data sheets and short video clips from our wide product range.

Please call or email us for your copy.

03/09/2010 09:06