NEWS

UV FastCheck™ Strips are simple, reliable, and easy to use indicators of accumulated UV light dosage. They are the first product that can be used to determine levels of UV dose with a simple, visual inspection due to the 5 separate color changing zones. Each of the 5 zones begin to change color after a specific amount of UV dose has been received. First the "1" zone begins turning from yellow to blue. Then each subsequent color zone starts to change colors when its specific chemistry has received the proper amount of UV to activate its color change.


The versatility of this unique UV measurement tool allows users to measure a significant range of UV doses. FastCheck Strips measure UV doses from 0mJ/cm² to greater than 5,000mJ(5J)/cm². As well, due to their paper-thin profile and thermal stability, they can be used in all applications where a radiometer is not possible, including: Web printing, Sheet Fed printing, Exposure Verification of exposed products, 3-D curing, and personal UV exposure level testing.

The FastCheck Strips' clearly identifiable color change enables users to visually differentiate the dose differences. UV FastCheck Strips can be further coupled with a handheld colorimeter to measure the dose even more precisely.

As well, we have prepared a comparative dose chart for the FastCheck Strips (N010-003) so that each tested FastCheck Strip can be correlated to the millijoules of UV energy that each color pattern represents. NOTE: This chart is comprised of actual exposed FastCheck Strips.

Made from the same exclusive material, the New UV Intensity Labels (N010-005) have the same color changing principle as the Strips, but they have only 1 color changing square. Click here for more information.

FEATURES:
• FastCheck Strips measure the entire UV spectrum
• Accurate visual determination of UV dose made possible
• Monitor UV dose in difficult-to-access curing environments
• Detect UV lamp degradation and equipment failures
• Provide the user with periodic assurance that their UV source is performing to expectations
• Greater rate of color change provides clearer, more precise UV dose determination
• Determine the dose profile in the 3D curing chambers or across wide webs to ensure even cure
• Measure the dose of sunlight in outdoor curing applications
• Evaluate and compare multiple UV light sources

SPECIFICATIONS:
• UV FastCheck Strips are available in packages 200 Strips (10 sheets of 20 adhesive backed Strips per sheet)
• UV FastCheck Strips Dimensions: 1/2”H x 2-1/8”W (13mm x 54mm)

Model 360 UV Exposure System (13.09.05)

Revolutionary new design cures UV tapes quickly and uniformly, features an ultra long life light source and handles all size wafers up to 300mm. 

The Model 360 UV exposure system needs no external ventilation and has a small 18” diameter footprint.

Model 360 Capabilities:

• Cures most UV tape in 30 seconds
• Digital timer counts down and gives audible signal when cycle is complete
• Has cover gas capability with purge timer
• Gas flow stops at end of cycle
• Light source has uniform output over 10,000 hours of operation
• Generates very little heat and no ozone
• Easy to operate. Virtually no training required
• No set-up required when changing wafer sizes

  TFC9000 THIN FILM CALORIMETER - QUALIFY YOUR INKS, COATINGS & ADHESIVES (13.09.05)

Is it the Inks or is it the Lamps? Know for Sure with the Thin Film Calorimeter.

You need a radiometer to ensure the performance and curing effectiveness of your UV lamps. So, how do you ensure the same of your inks, coatings and adhesives? Up until now, it was mostly guesswork. If you had curing problems and had ruled out your UV lamps as the culprit, your next target was most likely your chemistry. CON-TROL-CURE’s Thin Film Calorimeter (TFC) allows you to quantitatively measure the curability of your inks, coatings and adhesives.

The TFC-9000™ qualifies your inks, coatings and adhesives curability and ensures that they are curing consistently, batch-to-batch. Now you can test the shelf life of stored inks and evaluate older inks to know conclusively if they still perform to your expectations. Less wasted material translates into greater savings and profits.

The TFC-9000 measures the exothermic heat reaction from a polymerizing sample through a highly sensitive sensor. It performs a rapid analysis of the incoming data to produce meaningful results. Once the green "start" button is selected, the curing and evaluation process commences:
• Temperature recording starts
• The UV LED lamp automatically turns on
• The sample is cured
• Peak temperature reaction from the cured sample is reached and displayed
• Once the temperature reaches 75% of the peak, the lamp automatically shuts off

Upon successful test completion, the TFC-9000 displays key measured test results as indicated in the LCD displays:

• Heat Flux
• Peak Value of Heat (in BTU’s)
• Total Test Time
• Slope of the Curve for "Time to Peak" vs. "Heat Generated"
• Current Temperature
• Total Heat (in BTU’s/Hour)

The TFC-9000 works as a stand-alone measurement system or can be connected to a computer through a serial port. The captured data can be exported and plotted to an Excel graph for quick and easy analysis.

Note: The system is sold complete with the UV LED lamp. If a different UV source is required, various UV lamp options are available for use with the TFC-9000 system.

SPECIFICATIONS:
Dimensions: 12”W x 11.25”L x 6.25”H (30.5 cm x 28.6 cm x 15.9cm)
System Weight: 14.5 lbs (2.83 kg)
Sensor Resistance: 300 Ohms (Approx.)
Sensor Lead Wires: 10’ (3.1m) Solid copper, teflon insulated
Nominal Sensitivity: 3.0 µV/Btu/Ft²-Hr
Max Rec’d Heat Flux: 30,000 Btu/Ft²Hr
Response Time: 0.6 sec
Temperature Limit: 400°F (205°C)
Thermal Capacitance:0.03 Btu per Ft²-°F
Thermal Resistance: 0.01 °F per Btu/Ft²-Hr

NEW P.I. CAPILLARY FROM SPT (13.09.05)

The advancement in bonding technology and the market demand for faster, smaller and better product, again poses new challenges for the wire bonding process. The transition from fine-pitch (FP) to ultra fine-pitch (UFP) volume production, and the emergence of stacked die, multi-tier and low-K bonding has increased the level of difficulties in the wire bonding process with more yield loss due to lifted ball, wire shorts, etc.

In compliance with these new bonding requirements, SPT has embarked on an extensive study to develop a new generation and high-performance capillary. Designed with advanced process diagnostic tools, the new capillary design, known as the PI (Programmed Intelligence) capillary has been extensively tested in a variety of wire bonders and packages. In all tests, the PI capillary has demonstrated superior bonding performance with good repeatability and portability using a wide range of bonding platform.

Programmed Intelligence P.I. Capillary

The PI capillary was derived from a series of physical modeling and finite element analysis (FEA) studies to analyze the stress level at the tip and transition profile for different designs, as these are locations where breakage is most likely to occurs. An example of the analysis – in this case, for the PI design is as shown below. Among the options considered, the PI design showed the lowest overall stress. This result was validated through destructive test, which showed that the breaking load for the PI design is 7% higher as compared to other design option.

		Data Source	Design A	Design B	PI Design
	Stress @ Transition (x109 Pa)	Simulation	0.6632	0.5687	0.5417
	Stress @ Tip (x1011 Pa)	Simulation	0.1269	0.1253	0.1167
	Breakage load (gf)	Simulation	228	238	245

Figure 1: Correlation of the simulation data with the results of destructive test

Laser interferometry technique is also used to determine the optimum capillary profile through amplitude of vibration measurement along the overall profile of the capillary. In wire bonding, the vibration characteristics of the capillary is an important factor as its indicates the efficiency of the transfer of the ultrasonic energy from the bonding tool to the bond pad interface. Through the various design optimization, the PI design has shown to be more responsive to the bonding parameters, producing better bond integrity.

	Amplitude of Vibration (nm)
	Design A	Design B	PI Design
	454	488	544

Figure 2: Laser interferometry test results

Based on the various simulation and diagnosis, the PI capillary design was conceived. Actual bonding responses were tested using standard QFP and BGA package for a 70um bond pad pitch (BPP). The PI capillary was shown to be more responsive to the bonding parameter producing better results on all the measures (ball size, ball shear and stitch pull). In contrast, other design options would require higher bond force and more ultrasonic power to achieve the same bond integrity. This observation correlated with the result from the laser interferometry test. 

Figure 3: Average results from actual bonding responses

 Today, the PI capillary has been qualified and used in volume production by major assembly houses for a broad range of bonding applications. Depending on the specific bonding application, the PI design can be used together with the any existing design feature, such as the DFX (for small ball large wire bonding), CSP (for short loop/low wire bonding, BSB (ball stitch on ball bonding), Infinity (extended tool life), etc. Indeed, the PI capillary has proved to be a new revolution in bonding solution.

Click here to review the various bonding application and part number recommendations applicable with the PI capillary

CONSTANT AIR BLEED OPTION NOW AVAILABLE ON 
ALL COMCO MICRO-ABRASIVE BLASTERS (13.09.05)

Consistent operation of the MicroBlaster requires very clean, dry compressed air.  This can be easily achieved with the proper dryer installed on the air line.  A more difficult task is controlling

the environment where the blasting occurs.  Often it can be very wet and dirty, as in the case of hypodermic needle production facilities.  To keep the contamination from clogging the nozzles we have developed a Constant Air Bleed Option.

The constant air option functions alternately with the pinch valve.  When the machine is turned on clean air immediately begins flowing to the nozzle.  As soon as the abrasive stream is activated the bleed turns off.  The constant flow of air out to the nozzle keeps contamination from plugging into the nozzle and restricting the abrasive flow.

For more information about the Constant Air Bleed Option, call us today.

Learn about integrating micro-abrasive blasting with needle grinding from John Perry of Popper Precision Instruments in this month's MPMN on-line at:

http://www.devicelink.com/mpmn/archive/05/07/016.html .

REPAIR & REFURBISHMENT (26/04/05)

Its not a new service we offer but for our new and old customers we can carry out inspection, repair and refurbishment for all the Comco machines at our headquarters in Chard, Somerset. Depending on the nature of the problem and parts needed we will carry out a thorough  inspection and advise you of the condition of the essential parts for the machines operation. Before proceeding with any work we will consult you and request authorization to carry out work or return the machine with only a nominal inspection fee. We always endeavor to get machines repaired and turned around as quickly as possible.

Refurbishment is possible for machines that at first look beyond repair. The MB100 below has had a hard working life but despite the initial cosmetic condition which is the worst one we have seen to date, mechanically it was in relatively good condition. With a little TLC,a few hours labor, some paint and some spare parts we managed to transform the machine into one almost as good as new and it is now back in regular use at our customers site. Yes, it is actually the same machine.

BEFORE                                                              AFTER

                    Yes, it is actually the same machine!                       

UV LED CURE-ALL (18/04/05)

This amazing new lamp can simply perform in ways that current lamps cannot. In order to truly maximize the potential of this lamp technology, you need to forget all of your current assumptions in regards to how UV curing works. This lamp technology defies accepted UV curing limitations. It is simply doing what it should not be allowed to do. It's curing faster. It's power consumption is minimal. The mechanism of cure is operating beyond current standards, due to the fact that this lamp is 100% efficient.

New Epak 2005 CD-ROM Catalogue (18/04/05)

The latest update of the Epak Electronics CD Catalogue is now available. It features all of our product range, including data sheets and short video clips from our wide product range. 

Please call or email us for your copy.