NEWS
UV FastCheck™ Strips are
simple, reliable, and easy to use indicators of accumulated UV light dosage.
They are the first product that can be used to determine levels of UV dose
with a simple, visual inspection due to the 5 separate color changing zones.
Each of the 5 zones begin to change color after a specific amount of UV dose
has been received. First the "1" zone begins turning from yellow to
blue. Then each subsequent color zone starts to change colors when its
specific chemistry has received the proper amount of UV to activate its color
change.
The versatility of this unique UV measurement tool allows users to measure a
significant range of UV doses. FastCheck Strips measure UV doses from
0mJ/cm² to greater than 5,000mJ(5J)/cm². As well, due to their paper-thin
profile and thermal stability, they can be used in all applications where a
radiometer is not possible, including: Web printing, Sheet Fed printing,
Exposure Verification of exposed products, 3-D curing, and personal UV
exposure level testing.
The FastCheck Strips' clearly identifiable color change enables users to
visually differentiate the dose differences. UV FastCheck Strips can be
further coupled with a handheld colorimeter to measure the dose even more
precisely.
As well, we have prepared a comparative dose chart for the FastCheck Strips
(N010-003) so that each tested FastCheck Strip can be correlated to the
millijoules of UV energy that each color pattern represents. NOTE: This chart
is comprised of actual exposed FastCheck Strips.
Made from the same exclusive material, the
New UV Intensity Labels (N010-005) have the same color changing
principle as the Strips, but they have only 1 color changing square. Click
here for more information.
FEATURES:
• FastCheck Strips measure the entire UV spectrum
• Accurate visual determination of UV dose made possible
• Monitor UV dose in difficult-to-access curing environments
• Detect UV lamp degradation and equipment failures
• Provide the user with periodic assurance that their UV source is
performing to expectations
• Greater rate of color change provides clearer, more precise UV dose
determination
• Determine the dose profile in the 3D curing chambers or across wide webs
to ensure even cure
• Measure the dose of sunlight in outdoor curing applications
• Evaluate and compare multiple UV light sources
SPECIFICATIONS:
• UV FastCheck Strips are available in packages 200 Strips (10 sheets of 20
adhesive backed Strips per sheet)
• UV FastCheck Strips Dimensions: 1/2”H x 2-1/8”W (13mm x 54mm)
Model 360 UV
Exposure System (13.09.05)
Revolutionary new
design cures UV tapes quickly and uniformly, features an ultra long
life light source and handles all size wafers up to 300mm.
The Model 360 UV
exposure system needs no external ventilation and has a small 18”
diameter footprint.
Model 360
Capabilities:
- Cures most UV tape
in 30 seconds
- Digital timer
counts down and gives audible signal when cycle is complete
- Has cover gas
capability with purge timer
- Gas flow stops at
end of cycle
- Light source has
uniform output over 10,000 hours of operation
- Generates very
little heat and no ozone
- Easy to operate.
Virtually no training required
- No set-up required
when changing wafer sizes

TFC9000 THIN FILM CALORIMETER
- QUALIFY YOUR INKS, COATINGS & ADHESIVES (13.09.05)
Is it the
Inks or is it the Lamps? Know for Sure with the Thin Film Calorimeter.
You
need a radiometer to ensure the performance and curing effectiveness
of your UV lamps. So, how do you ensure the same of your inks,
coatings and adhesives? Up until now, it was mostly guesswork. If you
had curing problems and had ruled out your UV lamps as the culprit,
your next target was most likely your chemistry. CON-TROL-CURE’s
Thin Film Calorimeter (TFC) allows you to quantitatively measure the
curability of your inks, coatings and adhesives.
The TFC-9000™
qualifies your inks, coatings and adhesives curability and ensures that they
are curing consistently, batch-to-batch. Now you can test the shelf life of
stored inks and evaluate older inks to know conclusively if they still
perform to your expectations. Less wasted material translates into greater
savings and profits.
The TFC-9000 measures the exothermic heat reaction from a polymerizing sample
through a highly sensitive sensor. It performs a rapid analysis of the
incoming data to produce meaningful results. Once the green "start"
button is selected, the curing and evaluation process commences:
• Temperature recording starts
• The UV LED lamp automatically turns on
• The sample is cured
• Peak temperature reaction from the cured sample is reached and displayed
• Once the temperature reaches 75% of the peak, the lamp automatically
shuts off
Upon successful test completion, the TFC-9000 displays key measured test
results as indicated in the LCD displays:
• Heat Flux
• Peak Value of Heat (in BTU’s)
• Total Test Time
• Slope of the Curve for "Time to Peak" vs. "Heat
Generated"
• Current Temperature
• Total Heat (in BTU’s/Hour)
The TFC-9000 works as a stand-alone measurement system or can be connected to
a computer through a serial port. The captured data can be exported and
plotted to an Excel graph for quick and easy analysis.
Note: The
system is sold complete with the UV LED lamp. If a different UV source is
required, various UV lamp options are available for use with the TFC-9000
system.
SPECIFICATIONS:
Dimensions: 12”W x 11.25”L x 6.25”H (30.5 cm x 28.6 cm x 15.9cm)
System Weight: 14.5 lbs (2.83 kg)
Sensor Resistance: 300 Ohms (Approx.)
Sensor Lead Wires: 10’ (3.1m) Solid copper, teflon insulated
Nominal Sensitivity: 3.0 µV/Btu/Ft²-Hr
Max Rec’d Heat Flux: 30,000 Btu/Ft²Hr
Response Time: 0.6 sec
Temperature Limit: 400°F (205°C)
Thermal Capacitance:0.03 Btu per Ft²-°F
Thermal Resistance: 0.01 °F per Btu/Ft²-Hr
NEW P.I. CAPILLARY FROM SPT (13.09.05)
The
advancement in bonding technology and the market demand for faster, smaller
and better product, again poses new challenges for the wire bonding process.
The transition from fine-pitch (FP) to ultra fine-pitch (UFP) volume
production, and the emergence of stacked die, multi-tier and low-K bonding
has increased the level of difficulties in the wire bonding process with more
yield loss due to lifted ball, wire shorts, etc.
In
compliance with these new bonding requirements, SPT has embarked on an
extensive study to develop a new generation and high-performance capillary.
Designed with advanced process diagnostic tools, the new capillary design,
known as the PI (Programmed Intelligence) capillary has been extensively
tested in a variety of wire bonders and packages. In all tests, the PI
capillary has demonstrated superior bonding performance with good repeatability
and portability using a wide range of bonding platform.
Programmed
Intelligence P.I. Capillary
The PI
capillary was derived from a series of physical modeling and finite element
analysis (FEA) studies to analyze the stress level at the tip and transition
profile for different designs, as these are locations where breakage is most
likely to occurs. An example of the analysis – in this case, for the PI
design is as shown below. Among the options considered, the PI design showed
the lowest overall stress. This result was validated through destructive
test, which showed that the breaking load for the PI design is 7% higher as
compared to other design option.
 |
|
Data
Source
|
Design A
|
Design B
|
PI
Design
|
|
Stress @
Transition (x109 Pa)
|
Simulation
|
0.6632
|
0.5687
|
0.5417
|
|
Stress @
Tip (x1011 Pa)
|
Simulation
|
0.1269
|
0.1253
|
0.1167
|
|
Breakage
load (gf)
|
Simulation
|
228
|
238
|
245
|
Figure 1:
Correlation of the simulation data with the results of destructive test
Laser
interferometry technique is also used to determine the optimum capillary
profile through amplitude of vibration measurement along the overall profile
of the capillary. In wire bonding, the vibration characteristics of the
capillary is an important factor as its indicates the efficiency of the
transfer of the ultrasonic energy from the bonding tool to the bond pad
interface. Through the various design optimization, the PI design has shown
to be more responsive to the bonding parameters, producing better bond
integrity.
 |
Amplitude
of Vibration (nm)
|
|
Design A
|
Design B
|
PI
Design
|
|
454
|
488
|
544
|
Figure 2: Laser
interferometry test results
Based
on the various simulation and diagnosis, the PI capillary design was
conceived. Actual bonding responses were tested using standard QFP and BGA
package for a 70um bond pad pitch (BPP). The PI capillary was shown to be more
responsive to the bonding parameter producing better results on all the
measures (ball size, ball shear and stitch pull). In contrast, other design
options would require higher bond force and more ultrasonic power to achieve
the same bond integrity. This observation correlated with the result from the
laser interferometry test.
|
Readings
|
Design A
|
Design B
|
PI
Design
|
| Ball
size (um) |
25
|
52.6
|
53.3
|
53.8
|
| Ball
shear (gf)
Standard deviation
Failure mode
|
25
|
24.4
1.41
Ball
sheared
|
25.0
1.48
Ball
sheared
|
25.7
1.33
Ball
sheared
|
| Stitch
pull (gf)
Standard deviation
Failure mode
|
25
|
7.32
100%
Break
@ stitch
|
7.41
100%
Break
@ stitch
|
7.54
100%
Break
@ stitch
|
Figure 3:
Average results from actual bonding responses
Today, the PI capillary
has been qualified and used in volume production by major assembly houses for
a broad range of bonding applications. Depending on the specific bonding
application, the PI design can be used together with the any existing design
feature, such as the DFX (for small ball large wire bonding), CSP (for short
loop/low wire bonding, BSB (ball stitch on ball bonding), Infinity (extended
tool life), etc. Indeed, the PI capillary has proved to be a new revolution
in bonding solution.
Click here to review the various bonding application and part number
recommendations applicable with the PI capillary
CONSTANT AIR
BLEED OPTION NOW AVAILABLE ON
ALL COMCO MICRO-ABRASIVE BLASTERS (13.09.05)
Consistent
operation of the MicroBlaster requires very clean, dry compressed air. This
can be easily achieved with the proper dryer installed on the air line.
A more difficult task is controlling
the
environment where the blasting occurs. Often it can be very wet and
dirty, as in the case of hypodermic needle production facilities. To
keep the contamination from clogging the nozzles we have developed a Constant
Air Bleed Option.

The
constant air option functions alternately with the pinch valve. When
the machine is turned on clean air immediately begins flowing to the nozzle.
As soon as the abrasive stream is activated the bleed turns off. The
constant flow of air out to the nozzle keeps contamination from plugging into
the nozzle and restricting the abrasive flow.
For
more information about the Constant Air Bleed Option, call us today.
Learn
about integrating micro-abrasive blasting with needle grinding from John
Perry of Popper Precision Instruments in this month's MPMN on-line at:
http://www.devicelink.com/mpmn/archive/05/07/016.html
.
REPAIR & REFURBISHMENT
(26/04/05)
Its
not a new service we offer but for our new and old customers we can carry
out inspection, repair and refurbishment for all the Comco machines at our
headquarters in Chard, Somerset. Depending on the nature of the problem and
parts needed we will carry out a thorough inspection and advise you of
the condition of the essential parts for the machines operation. Before
proceeding with any work we will consult you and request authorization to
carry out work or return the machine with only a nominal inspection fee. We
always endeavor to get machines repaired and turned around as quickly as
possible.
Refurbishment
is possible for machines that at first look beyond repair. The MB100 below
has had a hard working life but despite the initial cosmetic condition which
is the worst one we have seen to date, mechanically it was in relatively good
condition. With a little TLC,a few hours labor, some paint and some spare
parts we managed to transform the machine into one almost as good as new and
it is now back in regular use at our customers site. Yes, it is actually the
same machine.
BEFORE
AFTER
Yes, it is actually the same machine!
UV LED CURE-ALL (18/04/05)
This amazing new
lamp can simply perform in ways that current lamps cannot. In order to truly
maximize the potential of this lamp technology, you need to forget all of
your current assumptions in regards to how UV curing works. This lamp
technology defies accepted UV curing limitations. It is simply doing what it
should not be allowed to do. It's curing faster. It's power consumption is
minimal. The mechanism of cure is operating beyond current standards, due to
the fact that this lamp is 100% efficient.
UV
curing without heat!
Heat sensitive substrates (films, foils, DVDs, CDs, etc.)
UV curing without radiometers!
Consistent lamp output for the first 50,000 hours!
UV curing without replacement lamps!
Keep your line running - no downtime!
| APPLICATIONS: |
|
|
| •
Laminating Adhesive |
•
3-D Curing |
•
Wire Marking |
| •
Silicone Release Lining |
•
CD/DVD |
•
Wire Tacking |
| •
Ink Jet |
•
Wood Repair/Finishing |
•
Contact Lenses |
| •
Narrow Web Flexo |
•
Medical Assembly |
•
Heat Sensitive Substrate Curing |
|
New Epak 2005 CD-ROM Catalogue (18/04/05)
The latest update of the Epak Electronics CD Catalogue is now
available. It features all of our product range, including data sheets and short
video clips from our wide product range.
Please call or email us for your
copy.
|