We had an unusual request for blasting the back of flex circuits to improve the laser solderability of the parts. The backing was too reflective and meant that the laser welds were not always consistent. A custom machine was built to create a uniform area over the back of the area soldered that would not reflect the laser and improve the efficiency of the weld.
The simple to use, machine has tooling to process 10 flexes on each cycle. A simple PLC controller takes care of the machine operation to control the pneumatic arm and the interlocks for the door and blast control.
COME AND SEE US AT ON STAND B3 AT MM LIVE UK 2010
THE MICRO, PRECISION AND NANO MANUFACTURING EVENT 19-20 OCTOBER 2010
MM Live is a global showcase for everything to do with the mass manufacture of small to micro precision parts, whether a company can make them to order or supply the machinery to mill, cut or mould. Companies from all industrial sectors are embracing the potential micro manufacturing can offer. As consumers demand small, lighter, and more portable products, MM Live offers the manufacturer the solutions. Exhibits cover the full spectrum of micro manufacturing techniques from laser cutting, welding, and micro machining to injection moulding, inspection & measurement, photo etching, handling and assembly.
Running parallel to the exhibition are a series of free workshops & seminars and specialist conferences. These include a two day educational “micro manufacturing technology” seminar programme alongside focused days for the Jewellery sector and other sessions covering metrology technology, CAD/CAM/CAE software and the world renowned TCT “rapid manufacturing” conference. At MM Live there truly is ‘something for everyone’.
MM Live provides the perfect exhibitor showcase with a broad range of technologies on display alongside a vast array of cutting edge seminars to enhance the visitor experience. Exhibitors are drawn from throughout the world but are all united with the common ability - to help engineers design, develop and manufacture micro and precision parts.
MM LIVE UK - NEXT EVENT 19-20 OCTOBER 2010
MM Live first opened its doors back in October 2008, drawing visitors from all over the UK and Europe, some from as far a field as Canada, USA, Japan and Israel. The enthusiasm and ‘buzz’ on the exhibition floor from both exhibitors and visitors alike was unmistakable, demonstrating that this exhibition has provided the industry with a much-needed platform to share its products and knowledge with micro manufacturers. The second event (2009) saw almost 50% growth in the number of exhibitors and visitors - testimony to the growing demand for micro manufacturing techniques across all manufacturing sectors.
We would like to thank all of the exhibitors who contributed to its success over the past two years. The commitment shown — and seriousness taken in shipping substantial machinery to the show — demonstrates the industry's desire for MM Live to succeed. There is no substitute for live working machinery when evaluating a capital purchase, something that MM Live will be further developing in 2010 along with more live demonstrations, training, and seminars.”More information & visit the MM Live Website here
YouTube Channel Online. We have uploaded videos of the Epak BV9000 wafer beveller and opened a YouTube Channel to show and demonstrate our equipment. The first of these shows the functions and features of the BV9000 beveller. More will be added soon.
Started in 1965 Comco Inc have been in business selling microblasters since their beginning. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years. As well as having sold almost every type of equipment offered by Comco in the last 40 years we have recently begun custom automation solutions where an off the shelf system is not available. See our Custom Products page for further details of what we can offer
RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.
09.03.2010 Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.
Giving an overview in some of the uses for micro-abrasive technology for applications such as Stent Processing, Wafer Drilling & Machining, Coating Removal and Surface Preparation and Wafer Bevelling.
14.01.2010 Epak Electronics Exhibiting at the Southern Manufacturing Show. in Farnborough 10th & 11th February 2010.
Visit us on stand 347 Five, Farnborough, Hants.
Free tickets are available by pre-registering at www.industrysouth.co.uk
There is free parking and free conferences available.
More details of the show including directions and an exhibitor list can be found here
We have just manufactured & supplied a custom blast cabinet for use with a Comco AF10 Accuflo. Our customer needed to clean some quite large fossils for which the Comco microblaster is perfectly suited due to its controllability on delicate parts.
18.09.09 Epak BV9000 Wafer Beveller Installed
Epak Electronics have completed and installed our latest custom project for a BV9000 wafer beveller. Our customer already had two 25 year old Comco BV8003 wafer bevellers but needed to scale up the size capability. Epak have manufactured the new machine and used our expertise in abrasives to create a robust and easy to use machine capable of handling wafers from 30mm to 150mm in size.
16.04.09 Comco to Exhibit at InterSolar Munich
Comco Inc. will exhibit micro-abrasive blasting equipment at the InterSolar Munich show, May 27-29, 2009, New Trade Fair Center, Munich, Germany booth A3.208. Nick Blamey from Epak will be on the booth at the show and visitors will have the opportunity to see how micro-abrasive blasting is used to texture wafers.
Micro-abrasive blasting is a technology that uses micro-sized particles of high grade abrasives propelled out of a small nozzle tip at high velocity to clean, cut, deburr, and texture a variety of surfaces. This technology offers the accuracy and control needed to effectively process small parts providing solutions for the solar industry.
Fast and consistent results can be obtained with manual or semi-automated micro-abrasive blasting solutions. Comco’s Applications Lab welcomes sample parts for testing to determine the most efficient method. Find out more about micro-abrasive blasting and sample parts testing at InterSolar Munich booth A3.208.
To find out more about InterSolar Munich and to register for the show, visit the official InterSolar Munich website.
Please join us on stand 1801 at the MEDTEC UK trade fair 25-26 March 2009 at the NEC in Birmingham, UK. Register by 27 February to receive your badge by post.
We look forward to seeing you in Birmingham, 25-26 March 2009.
To register, please visit http://www.devicelink.com/expo/mdt09/
For some applications, like handling large thin die, the preferred vacuum cavity is different than the traditional round or rectangular shape found on common rubber tips. The desired design is rather a cross groove or X sign or a multi hole configuration. This feature prevents the die to warp inside the vacuum cavity and to cause poor wetting or incomplete epoxy coverage during die placement. The outer shape of the tip depends on the size of TL/TW:2 or 4 tapered walls or vertical walls. Various custom vacuum channel or cavity configurations are possible on request.
The Safe-T-Stain consists primarily of metal salts, in an electrolyte which have been used extensively to stain the more n-type regions on the silicon wafer. This characteristic holds consistent with the p on p+ being darkened. Repeatable results are achieved by control of light intensity and staining time. Five compositions are available to permit selection of the most appropriate stain.
Overstained regions often require no refinishing; they are merely wiped with a dampener paper towel and re-stained. The chemical composition of this stain does not necessitate extraordinary safety precautions during it's use. Minimal experience and technique are needed to stain junctions with Philtec Safe-T-Stain, because a unique stain composition is available for most junction impurity concentration ranges.
UV FastCheck™ Strips are
simple, reliable, and easy to use indicators of accumulated UV light dosage.
They are the first product that can be used to determine levels of UV dose
with a simple, visual inspection due to the 5 separate color changing zones.
Each of the 5 zones begin to change color after a specific amount of UV dose
has been received. First the "1" zone begins turning from yellow to
blue. Then each subsequent color zone starts to change colors when its
specific chemistry has received the proper amount of UV to activate its color
TFC9000 THIN FILM CALORIMETER - QUALIFY YOUR INKS, COATINGS & ADHESIVES (13.09.05)
Is it the Inks or is it the Lamps? Know for Sure with the Thin Film Calorimeter.
You need a radiometer to ensure the performance and curing effectiveness of your UV lamps. So, how do you ensure the same of your inks, coatings and adhesives? Up until now, it was mostly guesswork. If you had curing problems and had ruled out your UV lamps as the culprit, your next target was most likely your chemistry. CON-TROL-CURE’s Thin Film Calorimeter (TFC) allows you to quantitatively measure the curability of your inks, coatings and adhesives.
qualifies your inks, coatings and adhesives curability and ensures that they
are curing consistently, batch-to-batch. Now you can test the shelf life of
stored inks and evaluate older inks to know conclusively if they still
perform to your expectations. Less wasted material translates into greater
savings and profits.
system is sold complete with the UV LED lamp. If a different UV source is
required, various UV lamp options are available for use with the TFC-9000
NEW P.I. CAPILLARY FROM SPT (13.09.05)
The advancement in bonding technology and the market demand for faster, smaller and better product, again poses new challenges for the wire bonding process. The transition from fine-pitch (FP) to ultra fine-pitch (UFP) volume production, and the emergence of stacked die, multi-tier and low-K bonding has increased the level of difficulties in the wire bonding process with more yield loss due to lifted ball, wire shorts, etc.
In compliance with these new bonding requirements, SPT has embarked on an extensive study to develop a new generation and high-performance capillary. Designed with advanced process diagnostic tools, the new capillary design, known as the PI (Programmed Intelligence) capillary has been extensively tested in a variety of wire bonders and packages. In all tests, the PI capillary has demonstrated superior bonding performance with good repeatability and portability using a wide range of bonding platform.
Programmed Intelligence P.I. Capillary
The PI capillary was derived from a series of physical modeling and finite element analysis (FEA) studies to analyze the stress level at the tip and transition profile for different designs, as these are locations where breakage is most likely to occurs. An example of the analysis – in this case, for the PI design is as shown below. Among the options considered, the PI design showed the lowest overall stress. This result was validated through destructive test, which showed that the breaking load for the PI design is 7% higher as compared to other design option.
Figure 1: Correlation of the simulation data with the results of destructive testLaser interferometry technique is also used to determine the optimum capillary profile through amplitude of vibration measurement along the overall profile of the capillary. In wire bonding, the vibration characteristics of the capillary is an important factor as its indicates the efficiency of the transfer of the ultrasonic energy from the bonding tool to the bond pad interface. Through the various design optimization, the PI design has shown to be more responsive to the bonding parameters, producing better bond integrity.
Figure 2: Laser interferometry test resultsBased on the various simulation and diagnosis, the PI capillary design was conceived. Actual bonding responses were tested using standard QFP and BGA package for a 70um bond pad pitch (BPP). The PI capillary was shown to be more responsive to the bonding parameter producing better results on all the measures (ball size, ball shear and stitch pull). In contrast, other design options would require higher bond force and more ultrasonic power to achieve the same bond integrity. This observation correlated with the result from the laser interferometry test.
Figure 3: Average results from actual bonding responses
Today, the PI capillary has been qualified and used in volume production by major assembly houses for a broad range of bonding applications. Depending on the specific bonding application, the PI design can be used together with the any existing design feature, such as the DFX (for small ball large wire bonding), CSP (for short loop/low wire bonding, BSB (ball stitch on ball bonding), Infinity (extended tool life), etc. Indeed, the PI capillary has proved to be a new revolution in bonding solution.
BLEED OPTION NOW AVAILABLE ON
Yes, it is actually the same machine!
This amazing new lamp can simply perform in ways that current lamps cannot. In order to truly maximize the potential of this lamp technology, you need to forget all of your current assumptions in regards to how UV curing works. This lamp technology defies accepted UV curing limitations. It is simply doing what it should not be allowed to do. It's curing faster. It's power consumption is minimal. The mechanism of cure is operating beyond current standards, due to the fact that this lamp is 100% efficient.
curing without heat!
Heat sensitive substrates (films, foils, DVDs, CDs, etc.)
UV curing without radiometers!
Consistent lamp output for the first 50,000 hours!
UV curing without replacement lamps!
Keep your line running - no downtime!
Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Nitrogen Storage Cabinets - Thermal Interface Materials - UV Curing Systems, UV Test Equipment and Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding