LED Thermal Interface Materials

LED Thermal Interface Materials

Effective Thermal Interface Materials and Adhesives for Lowering LED Device Temperature for Higher Brightness:

Management of heat dissipation in LED lighting device is critical for highest brightness and long-term performance. AIT has dedicated product developments with patented technologies that have proven to achieve the lowest thermal resistance from chip to heat-sink. The total material solutions help to have the lowest LED device temperature from die-attach to module sub-mounting and heat-sink interface.

With over 30 years of experience in inventing and formulating speciality adhesives for electronic applications, AIT provides one of the most comprehensive thermal interface solutions that are engineered to facilitate manufacturability and throughput:

Rapid curing electro-thermal LED die-attach pastes
Compressible pressure sensitive thermal film that is industry best to provide instant bonding and lowest thermal resistance for large area LED sub-mounting
Melt-bonding thermal adhesive that can be pre-applied for LED module sub-mounting and achieving full curing in-situ without applied pressure
Conformal compressible phase change or pressure sensitive thermal interfaces for LED modules to heat-sink for largest displays

THERMAL INTERFACE MATERIALS FOR ROBUST LED LIGHTINGS, DISPLAYS AND PANELS: LED Die-Attach Adhesive, LED Submount Thermal Adhesive, LED Module Mounting Compressible Thermal Interface Phase-Change Pad

LED Die-Attach Adhesive with proven high Thermal Conductivity and Low Thermal Interface Resistance
LED Submount and LED Module mounting Thermal Film Adhesive with Instant Melt-Bonding
Compressible, Conformal Phase-Change Thermal Interface Pad for LED Heat-Sink
Insulated Metal Thermal Substrate for Metal-Core Printed Wiring Board (MCPCB) with 2X Thermally Conductivity for LED Submout and LED Module

What distinguishes AIT LED total thermal management material solutions besides the unparalleled and proven low thermal resistance in the die-attach, sub-mount and heat-sink are the long-term reliability and consistent performance after years of thermal shock and cycling with the build-in stress relief, and molecular structures that are engineered to prevent “drying” or cracking inside the materials and along the interface surfaces.

Ultra-low electrical and thermal resistance between LED dies and sub-mount or substrate. High mechanical strength and glass transition temperature to enable fast wiring bonding as high as 275°C.
For sub-mounting, molecular flexibility is specifically engineered in the thermal adhesive to provide stress absorption even in the most mis-matched CTE substrates and surfaces that extend to below -55°C. Depending on the assembly process, LED sub-mounting has a choice of novel and the only proven pressure sensitive thermal adhesive or a melt-bonding thermal adhesive film.
In the heat-sink interface layer, AIT provides the patented and proven compressible and conformable interface pad to eliminate trapped air and accommodate irregularity in gap that need to be filled.
Ultra-low moisture absorption and sensitivity
RoHS, REACH and WEEE compliant that meets UL94V-0 rating.

Properties of COOL-BOND™ Die-Attach for LED Device Applications

PROPERTY/PARAMETER

ME 8512

ME 8638-UT

ME 7519-LB

Electrical Resistivity

<0.0003 ohm-cm

<0.0003 ohm-cm

>10¹⁴ ohm-cm

Viscosity @5.0 rpm/Thixotropic Index

10,000 cps/4.0

10,000 cps/4.0

20,000cps/>3

Glass Transition Temperature (°C)

52

90

52

Device Push-off Strength (psi)

>3000

>3000

>3000

Hardness (Type)

~ 80

~ 90

~ 85

Cured Density of Conductive Adhesive Portion (gm/cc)

4.0

4.6

2.5

Thermal Conductivity

> 12.0 W/m-°K

> 12.0 W/m-°K

> 12.0 W/m-°K

Linear Tab-Composite Thermal Expansion Coefficient  (ppm/°C)

40 (X-Y=Z,  Isotropic)

38 (X-Y=Z,  Isotropic)

45 (X-Y=Z,  Isotropic)

Maximum Continuous Operation Temperature (°C)

> 180

> 180

> 180

Decomposition Temperature @5% weight loss (°C)

>450

>450

>450

Recommended Curing Temperature/Time (°C/min.)

>175/10

>175/10

>175/10

Extreme Thermal Adhesive for Module Sub-Mounting

Instant Bonding Compressible Pressure Sensitive Adhesive Pad
Melt-tacking and In-situ Curable Low Thermal Resistance Film Adhesive
Proven Lower LED Junction and Device Temperature for Higher Brightness
LED MODULE Sub-mounting

Module Sub-Mounting Thermal Adhesives

PROPERTY/PARAMETER

RTK 7555

RTK 7554

ME 7519-LB

Thermal Conductivity

> 0.2 W/m-°C

> 0.2 W/m-°C

> 0.2 W/m-°C

Dielectric Strength (Volts/mil)

>550

>300

>750

Device Push-off Strength (psi)

>1000

>1000

>1000

Cured Density (gm/cc)

2.5

2.5

2.5

Thermal Conductivity

> 3.0 W/m-°C

> 8.0 W/m-°C

> 12 W/m-°C

Maximum Continuous Operation Temp. (°C)

> 150

> 150

> 150

Electrical Resistivity

>10¹⁴ ohm-cm

>10¹⁴ ohm-cm

>10¹⁴ ohm-cm

Compressible Phase-Change Thermal Interface Pads

Compressible and conformal couples with phase change to allow elimination of voids
Proven for most stringent applications including military applications
US patented innovation
Non-silicone and non-contaminating

Compressible Thermal Gap Pad Thermal Interface

Compressible and conformal
Proven for large area requiring thermal filling into height gaps of different components
Ideal for large area display and module to device enclosure
Proven and used for most critical thermal challenges with military grade reliability
Non-silicone and non-contaminating
Available with different thickness with one-side or both side pressure sensitive

Other AIT Thermal Interface Materials for HB LED Applications

FUNCTION

AIT PART #

THERMAL, ELECTRICAL AND OTHER RELEVANT PROPERTIES

Compressible Phase-Change

COOL-SILVER™ PAD CPR8850-LB

  • Lowest thermal resistance, electrically non-conductive interface pad
  • Compressible, phase-change interface pad  (US patented)

Compressible Phase-Change

COOL-SILVER™  G3 PAD

  • Lower cost version of the lowest thermal resistance pad
  • Compressible, phase-change interface pad  (US patented)

Compressible Phase-Change

COOL-PAD™  CPR7158

  • Modified aluminum nitride filled with one of the lowest thermal resistance
  • Compressible, electrically insulating phase-change pad (US patented)

Compressible Phase-Change

COOL-PAD™  CPR7155-LB

  • Modified aluminum oxide filled with one of the lowest thermal resistance
  • Compressible, electrically insulating phase-change pad (US patented)

Gap-Filling Thermal Pad

COOL-GAPFILL™

DT, TT

  • Gap filling compressible  thermal pad with the lowest thermal resistance
  • One-side tacky (DT) or both side tacky (TT) for different applications

Compressible Gel-Film

COOL-GELFILM™

SZ

  • Thin compressible gel like film
  • Non-curing thin bond-line thermal interface

Thermal Grease

COOL-SILVER™

G3 Grease

  • Non-curing, electrically non-conductive interface grease
  • Lowest thermal resistance, non-silicone, proven long-term stability

Thermal Grease

COOL-GREASE™

CGR7559-LB

  • Lowest thermal resistance, electrically insulating interface grease
  • Non-curing, non-silicone, proven long-term stability

Thermal Gel

COOL-SILVER™

G3 Gel

  • Non-curing, electrically non-conductive interface gel forming paste
  • Non-silicone grease, proven thermal stability similar to thermal pad

Electro-Grease

COOL-GREASE™

CGR8550

  • Non-curing, electrically conductive interface grease for moving parts
  • Lowest thermal resistance non-silicone grease, proven long-term stability

CONTACT US FOR LED THERMAL INTERFACE MATERIALS PRODUCT ADVICEPRICE QUOTE - email us at sales@epakelectronics.com
Need an N.D.A. (non-disclosure agreement), no problem, just get in touch.

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