Conductive adhesives and sealants are important part of emi noise reductions in cellular phones and other communication devices. Printed circuit board shielding with conductive adhesive and sealants ensures low EMI/RFI noises for effective communications for cellular, WiFi, and RFID devices operating at UHF and microwave frequencies.
Flexible conductive adhesive laminates used in shielding flexible printed circuit board are critical for the reduction of EMI noises in the smartphone applications.
AIT has been manufacturing and supplying EMI/RFI shielding coatings, caulks, adhesives and gaskets since 1981. We have one of the most experienced material engineering and application staff in the industry. The following are some representative products.
CONTACT US FOR EMI, RFI and ESD PROTECTIVE MATERIAL PRODUCT ADVICENeed an N.D.A. (non-disclosure agreement), no problem, just get in touch.
ADHESIVES, EPOXIES AND FILMS AVAILABLE:
Automotive Electronic & Electrical Adhesives
Coatings & Protection
CPU Cooling - COOL-SILVER™
Custom Material Solutions
Dicing, Lapping and Grinding Tapes
Die, Substrate and Component Attach Materials
Lid Seal Solutions
Thermal Management Materials
EMI, RFI and ESD Shielding and Protection
Flex Circuit Materials
MIL-STD 883C 5011.4 Compliant Materials
NASA Outgassing Compliant Materials
Optical and Optoelectronic Materials
Solar Panel Materials
Underfill and Encapsulation Materials