Ball Stitch On Ball (BSOB) Capillaries

Ball Stitch On Ball (BSOB) Bonding Capillaries from SPT

For extremely low loop profile of about <50um wire bonding application, the ball stitch on ball (BSOB) is an alternative choice. The process is a two-step one cycle; the first is to form a stud ball bump into the bond pad; and then a reverse bonding (the ball bond is bonded into the lead frame, and stitch on top of the ball bump). The general design rule for the capillary selection for BSOB bonding follows the basic wire bonding fundamentals. 8° face angle is recommended to improve the stitch bondability.

BSOB bond Capillaries from SPT BSOB bond Capillaries from SPT

BSOB bond Capillaries from SPT


Capillary Part Number Selection Guide

The capillary design selection guide is always based on specific device & package configuration, wire type, and wire bonder. The selection of capillary part number process is simplified as follows:

Capillary Tip The selection of capillary tip design is determined by the device and metallization, bond pad pitch, bond pad opening, wire size, target mashed ball diameter, and critical loop height to derive the hole diameter(HD), chamfer diameter (CD), chamfer angle (CA), tip diameter (T) and face angle (FA).

Shank Style The shank style selection is characterized by geometrical design of the capillary bonding tool as dictated by specific device and / or package configuration.

Surface Finish The selection of a particular capillary tip surface finish hinges on whether the application is for gold or copper wire bonding.

Material Capillary material selection for optimum tool life performance for a given bonding application.

Wire Type The proper selection of capillary design is a resultant of the various wire bonding considerations.

Fine Pitch Part Number Selection

Infinity 3X Longer Tool Life

SPT 'Infinity' capillary material extends the tool life up to 3X its original tool life. This option is available on many tools and is a proprietary process SPT use to increase tool life.


ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - BSOB Wire Bonding CapillariesPRICE QUOTE - email us at sales@epakelectronics.com
BSOB Capillaries - How To Order
Ball Stitch On Ball Wire Bonding Sequence Information


BONDING CAPILLARIES & ACCESSORIES WE OFFER:

Non-Fine Pitch Capillaries (UT)UT NON-FINE PITCH CAPILLARIES
QFN (Quad Flat Non-Lead) SQ Capillary for gold and copper wire bondingQFN PACKAGE COPPER & GOLD WIRE BONDING CAPILLARY
Copper Wire Bonding Capillaries (SU)COPPER WIRE BONDING CAPILLARY
Enhanced Stitch Bond CapillariesENHANCED STITCH BONDABILITY
Advanced Bonding ApplicationsADVANCED BONDING APPLICATIONS
AZR Copper Bonding Capillary MaterialAZR LONG LIFE MATERIAL FOR CU WIRE BONDING
INFINITY 3X LONGER TOOL LIFEINFINITY 3X LONGER TOOL LIFE
Ball Stitch On Ball Wire Bonding CapillariesBALL STITCH ON BALL (BSOB)
Stud Ball Bumping (SBB) Bonding CapillarySTUD BALL BUMPING
Several different taper styles are available: One Side Relief, Double Side Relief, 90 Degree Double Side Relief and Vertical Bottle NeckSPECIAL CAPILLARY TAPER DESIGNS
Capillary unblocking and unplugging wireCAPILLARY UNPLUGGING WIRE (CUW)
EFO Wands for Capillary Bonding by SPTEFO WANDS
Window Clamps & Heater Block For QFP SOP & Multi-lead PackagesWINDOW CLAMPS & HEATER BLOCK
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