 ADVANCED BONDING APPLICATION (PI)
PROGRAMMED INTELLIGENCE CAPILLARY
 
Designed for advanced bonding
application, such as low-k, stacked die, ultra-fine pitch
wire bonding with better ultrasonic transmission.
The advancement in bonding technology and the market
demand for faster, smaller and better product, again poses
new challenges for the wire bonding process. The
transition from fine-pitch (FP)to ultra fine-pitch (UFP)
volume production, and the emergence of stacked die,
multi-tier and low-K bonding has increased the level of
difficulties in the wire bonding process with more yield
loss due to lifted ball, wire short, etc.
In compliance with these new bonding requirements, SPT
has embarked on an extensive study to develop a new
generation, high-performance capillary. Designed with
advanced process diagnostic tools, the new capillary
design, known as PI (Programmed Intelligence) capillary
has been extensively tested in a variety of wire bonders
and packages. In all tests, the PI capillary has
demonstrated superior bonding performance with good
repeatability and portability using a wide range of
bonding platforms.
Features
|
