The oldest and still commonly used method in semiconductor assembly is wedge-to-wedge wire bonding. SPT was involved in the early development of wedge tool design and presently offers a wide selection depending on the wire size, using Au or Al wire ranging from .0005”-.003”(13µm-76µm), and large Al wire .003”-.020”(76µm-500µm). Tools for ribbon wire and various TAB applications are also available under this product category.
Small Wire Bonding Tools
Fine Pitch Bonding Tool (FP)
Universal Bonding Tool (UT/US)
Chip-On-Board AutoBonding Tool (UT)
AutoBonding Tool (ABT)
Microwave Bonding Tool (M)
Series Slimline Notch Bonding Tools (1100/1200/1300/1400)
Back Bonding Wedge (1001/1002/1110)
SPT aquired the business activities of Microminiature Technology, Inc. and continues to produce wedges bonding tools with Osmium-Carbide alloy.Check SPT Catalogue for design - and order with Material designation M (Microloy) in place of W, Ti or C.