Microwave devices commonly have bonding pads as small as .001"/ 25µm
square. They are typically bonded with .0005"/13µm to .001"/25µm
diameter gold wires. Microwave devices have some special requirements that
are not seen in monolithic devices special requirements include the variety
of chips within the package, step heights within the products that require
deep access requirements, as well as critical loop shapes for tuning of the
device. We have developed a range of tools to meet the small foot print, and
critical loop requirements.
Tool Styles : M30A, M38A, M45A, M55A, M60A, M30B, M38B,
M45B, M55B, M60B
Data Sheet.