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COB SERIES - CHIP-ON-BOARD AUTOBONDING WEDGE

Chip-On-Board technology is successfully used to connect semiconductors to PCBs for high integration of electronic systems or microsystems. General conditions and procedures of chip and wire bonding are highly developed for standard applications, but new materials , increasing pin numbers, complex system integration processes and demands for higher reliability in low cost throw-away assemblies and more expensive profile-critical products has led to required improvements in the material, design and life of the tool.

SPT has developed tools in partnership with key OEM's to meet these demands

Tool Style : UT30A with 30 degree feed angle

Data Sheet.

 

 

13/08/2008 14:34

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

EPAK
 

Latest  News:

 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

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