Chip-On-Board technology is successfully used to connect semiconductors to
PCBs for high integration of electronic systems or microsystems. General
conditions and procedures of chip and wire bonding are highly developed for
standard applications, but new materials , increasing pin numbers, complex
system integration processes and demands for higher reliability in low cost
throw-away assemblies and more expensive profile-critical products has led to
required improvements in the material, design and life of the tool.
SPT has developed tools in partnership with key OEM's to meet these
demands
Tool Style : UT30A with 30 degree feed angle
Data Sheet.
