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COB SERIES - CHIP-ON-BOARD AUTOBONDING WEDGE

Chip-On-Board technology is successfully used to connect semiconductors to PCBs for high integration of electronic systems or microsystems. General conditions and procedures of chip and wire bonding are highly developed for standard applications, but new materials , increasing pin numbers, complex system integration processes and demands for higher reliability in low cost throw-away assemblies and more expensive profile-critical products has led to required improvements in the material, design and life of the tool.

SPT has developed tools in partnership with key OEM's to meet these demands

Tool Style : UT30A with 30 degree feed angle

Data Sheet.

Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.

18/01/2012 03:50

Latest News:

06.07.2011

NEW Comco CTR200 Procenter Plus Workstation /Dust Extractor

Lighter, brighter, cleaner and quieter.

09.03.2011

Custom Flex Circuit Abrader

We had an unusual request for blasting the back of flex circuits to improve the laser solderability of the parts. The backing was too reflective and meant that the laser welds were not always consistent. A custom machine was built to create a uniform area over the back of the area that is soldered. This means that the area would not reflect the laser and improve the efficiency of the weld.

21.10.2010

SA150 Video of our Surface Abrader added to our YouTube channel

09.08.2010

BV9000 Videos Added of our Rectifier Beveller to our new YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers.

27.10.08 SPT RTR-D2/D3 series Special Pickup Tips for thin or fragile components

14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles.

18.04.08 NEW from AI Technology : COOL-SILVER^{TM CPU
Thermal Grease gives 2-3
degree centigrade lower temperatures over the industry
"standards" even for a medium performing CPS for longer life
of the processors and electronic devices.}

19.03.08 : New Website Launched