There are a number of technical challenges unique to fine pitch wire-bond
process. It includes a broad mix of component technologies. A typical package
may contain 200 different components ranging in size from (.008 inch X .008
inch) and .004 inches thick to (.500 inch X .500 inch). The sheer number of
different sized chips and tight chip-to-chip spacing create problems in
accessing the bond pads. Fine pitch wire-bonding is of particular importance
in the manufacturing of these devices. Fine pitch is defined as 100 microns
or less center-to-center distances between bond pads. Many devices use the
latest high performance chips that typically include 4 mil pitch bond pads.
Innovations in tool configurations, machine vision systems and wire-bonding
ultrasonics have been critical to improved fine pitch wedge bonding.
Tool Styles : FP30A, FP38A, FP45A, FP55A, FP60A, FP30B,
FP38B, FP45B, FP55B, FP60B, FP30C, FP38C, FP45C, FP55C, FP60C
Data Sheet.