WIRE BONDABLE CHIP RESISTORS (MSTF)

Wire Bondable Chip Resistors from Mini-Systems

Mini-Systems Inc. Wire Bondable Chip Resistor series offers the design engineer a wide variety of styles with high stability, low TCR and low noise of Thin Film materials to meet the demands of cutting edge design requirements. Electrical connection to associated circuitry is accomplished through wire bonding to terminations located on the top side of the chip. Suitable die attachment methods are epoxy or eutectic attach.

CASE SIZE

TYPE

LENGTH “/mm

WIDTH “/mm

LOW VALUES


NiCr or [TaN] on Si or Quartz

NiCr of [TaN] on Si or Quartz

POWER Quartz

POWER Si Al2O3

POWER AlN

POWER BeO

0201

21

0.020”(0.508)

0.010”(0.254)

1-3 Ohm

3-350K [500k]

3-55K [71.5K]

10mW


50mW


200mW


400mW


0202

122

0.020”(0.508)

0.016”(0.406)

1-3 Ohm

3-1M [1.3M]

3-75K [97.5K]

25mW

125mW

500mW

1W

0302

32

0.030”(0.762)

0.020”(0.508)

1-3 Ohm

3-1.5M [2M]

3-200K [250K]

50mW

250mW

1W

2W

0402

110

0.037”(0.940)

0.017”(0.432)

1-3 Ohm

3-2M [3M]

3-200K [250K]

25mW

125mW

500mW

1W

0404

4

0.040”(1.016)

0.040”(1.016)



1-7.5M [11M]

1-500K [650K]

70mW

350mW

1.4W

2.8W

0502

115

0.050”(1.270)

0.025”(0.635)



3-4.5M [6.5M]

3-325K [420K]

50mW

250mW

1W

2W

0603

63

0.060”(1.524)

0.030”(0.762)

1-3 Ohm

3-7.5M [11M]

3-500K [650K]

100mW

500mW

2W

4W

0805

85

0.075”(1.905)

0.050”(1.270)



1-30M [40M]

1-2.5M [3.25M]

100mW

500mW

2W

4W

1010

121

0.100”(2.540)

0.100”(2.540)



1-60M [70M]

1-4M [5M]

150mW

750mW

3W

6W

MSTF118 will continue to be available, size and characteristics similar to MSTF122
MSPR1 will continue to be available, size and characteristics similar to MSTF53
MSMR1 will continue to be available, size and characteristics similar to MSTF101

How To Order Mini-Systems Inc Parts - Chart and Part Number Definition

ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - MSTF SERIES BACK CONTACT RESISTORS (PLEASE ADVISE SIZE, VALUE, TOLERANCE and QUANTITY)PRICE QUOTE - email us at sales@epakelectronics.com
Part Number - MSPR1 SERIES BACK CONTACT RESISTORS (PLEASE ADVISE SIZE, VALUE, TOLERANCE and QUANTITY)PRICE QUOTE - email us at sales@epakelectronics.com
Part Number - MSMR1 SERIES DUAL BACK CONTACT RESISTORS (PLEASE ADVISE SIZE, VALUE, TOLERANCE and QUANTITY)PRICE QUOTE - email us at sales@epakelectronics.com
MSTF Wire Bondable Thin Film Resistors Datasheet
(OLD) MSPR Wire Bondable Thin Film Resistors Datasheet
(OLD) MSMR Wire Bondable Thin Film Resistors Datasheet
MOQ is typically 25pcs. Price breaks: 25-49, 50-99, 100-249, 250-499, 500-999, 1000-2499, 2500-4999, 5000-9999, 10K+
Samples may be available on request - please contact us with your requirements to check availability.

ROHS Compliant Lead Free Solder Available

 

OTHER RESISTORS, NETWORKS AND MOS CHIP CAPACITORS WE OFFER:

Surface Mount Wrap and Half Wrap Thin Film Resistors by MSISURFACE MOUNT THIN FILM RESISTORS
Mini-Surface Mount Thin Film Resistors by MSIMINI-SURFACE MOUNT THIN FILM RESISTORS
Back Contact Chip ResistorsBACK CONTACT CHIP RESISTORS
Wire Bondable Resistors - MSTF, MSPR and MSMR SeriesWIRE BONDABLE RESISTORS
Wire Bondable Resistors - MSTF, MSPR and MSMR SeriesHIGH VALUE WIRE BONDABLE RESISTORS
M.O.S. Chip CapacitorsMOS CHIP CAPACITORS
Micro Dispensing nozzles - Sub 200 Micron DispensingMICROWAVE CHIP RESISTORS
Thin Film Jumpers & Standoffs (MSJC & WAJC SERIES)JUMPERS & STANDOFFS
Thick Film ResistorsTHICK FILM RESISTORS
Dual Thin Film Chip ResitorsDUAL THIN FILM RESITORS
High Powered Thin Film ResitorsTOP CONTACT HIGH POWER RESISTORS (PTWB SERIES)
High Powered Thin Film ResitorsHIGH POWER THIN FILM RESISTORS (PTSM SERIES)
Thin Film Attenuators Pi and T types inc SMDCHIP ATTENUATORS
Thin Film Resistor ArraysRESISTOR ARRAYS
Multi-Tap Thin Film Resistor ArraysMULTI-TAP RESISTOR ARRAYS
Surface Mount Resistor Networks - RSMA SeriesSURFACE MOUNT RESISTOR NETWORKS
Thin Film RC NetworksRC NETWORKS
Custom Thin Film Patterned SubstratesCUSTOM PATTERNED SUBSTRATES
Mini-Systems Obsolescence StatementMSI OBSOLESCENCE STATEMENT