Mini-Systems Inc. Wire Bondable Chip Resistor series offers the design engineer a wide variety of styles with high stability, low TCR and low noise of Thin Film materials to meet the demands of cutting edge design requirements.
Electrical connection to associated circuitry is accomplished through wire bonding to terminations located on the top side of the chip. Suitable die attachment methods are epoxy or eutectic attach.
| CASE SIZE | TYPE | LENGTH “/mm | WIDTH “/mm |
LOW VALUES
|
NiCr or [TaN] on Si or Quartz | NiCr of [TaN] on Si or Quartz | POWER Quartz | POWER Si Al2O3 | POWER AlN | POWER BeO |
| 0201 | 21 | 0.020”(0.508) | 0.010”(0.254) | 1-3 Ohm | 3-350K [500k] | 3-55K [71.5K] |
10mW
|
50mW
|
200mW
|
400mW
|
| 0202 | 122 | 0.020”(0.508) | 0.016”(0.406) | 1-3 Ohm | 3-1M [1.3M] | 3-75K [97.5K] | 25mW | 125mW | 500mW | 1W |
| 0302 | 32 | 0.030”(0.762) | 0.020”(0.508) | 1-3 Ohm | 3-1.5M [2M] | 3-200K [250K] | 50mW | 250mW | 1W | 2W |
| 0402 | 110 | 0.037”(0.940) | 0.017”(0.432) | 1-3 Ohm | 3-2M [3M] | 3-200K [250K] | 25mW | 125mW | 500mW | 1W |
| 0404 | 4 | 0.040”(1.016) | 0.040”(1.016) |
|
1-7.5M [11M] | 1-500K [650K] | 70mW | 350mW | 1.4W | 2.8W |
| 0502 | 115 | 0.050”(1.270) | 0.025”(0.635) |
|
3-4.5M [6.5M] | 3-325K [420K] | 50mW | 250mW | 1W | 2W |
| 0603 | 63 | 0.060”(1.524) | 0.030”(0.762) | 1-3 Ohm | 3-7.5M [11M] | 3-500K [650K] | 100mW | 500mW | 2W | 4W |
| 0805 | 85 | 0.075”(1.905) | 0.050”(1.270) |
|
1-30M [40M] | 1-2.5M [3.25M] | 100mW | 500mW | 2W | 4W |
| 1010 | 121 | 0.100”(2.540) | 0.100”(2.540) |
|
1-60M [70M] | 1-4M [5M] | 150mW | 750mW | 3W | 6W |
MSTF118 will continue to be available, size and characteristics similar to MSTF122 MSPR1 will continue to be available, size and characteristics similar to MSTF53 MSMR1 will continue to be available, size and characteristics similar to MSTF101
ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS and QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - MSTF SERIES BACK CONTACT RESISTORS
Part Number - MSPR1 SERIES BACK CONTACT RESISTORS
Part Number - MSMR1 SERIES DUAL BACK CONTACT RESISTORS
MSTF Wire Bondable Thin Film Resistors Datasheet
(OLD) MSPR Wire Bondable Thin Film Resistors Datasheet
(OLD) MSMR Wire Bondable Thin Film Resistors Datasheet
MOQ is typically 25pcs. Price breaks: 25-49, 50-99, 100-249, 250-499, 500-999, 1000-2499, 2500-4999, 5000-9999, 10K+ Samples may be available on request - please contact us with your requirements to check availability.
Resistors & Components
Wire Bondable Chip Resistors
Surface Mount Wrap Around Resistors
Microwave Chip Resistors
Thin Film Multi-Tap Resistors
Mini-SMT Surface Mount Resistors
Surface Mount Resistor Networks
Thick Film Surface Mount Resistors
Surface Mount Resistor Networks
QPL Precision Resistors
Flip Chip Thick Film Resistors
Thin Film Jumpers & Standoffs
Thin Film Patterned Substrates
Thick Film Chip Attenuators
Thick Film Jumpers
Mounting Pads and Kits
Thin Film Attenuators
Thin Film RC Networks (MRCN SERIES)
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