MSR SERIES THICK FILM CHIP RESISTORS

Wire Bondable or Flip Chip thick film resistors, printed and fired on 96% alumina with oversized top bonding pads, are offered in a variety of styles to fit a wide range of hybrid microelectronic and surface mount applications. Advanced processing techniques, and Hi-Rel construction assure optimum performance where TCR, VCR and operating power are critical factors. MSR styles have proven QPL reliability.

MSR-SERIES WIRE BONDABLE OR FLIP CHIP Standard Termination Materials : Untinned - Palladium silver, Platinum Gold, Gold  Solder Tinned - Palladium silver, Platinum Gold, Gold Data Sheet.

We offer a variety of high reliability thin film and thick film components from Mini-Systems Inc. Mini-Systems have the QPL MIL-PRF-55342 style parts including 'S'-Level failure rate qualified. Mini-Systems Package Division offer high performance, alumina / glass walled packages in flat pack, plug-in and surface mount configurations for microwave applications. Call us for more information and tell us what you need.