Mini-Systems, Inc. Surface Mount Chip Resistors are available in a wide range of case sizes, with each size offered in wrap around and half wrap termination styles. All solderable terminations have a nickel barrier for enhanced solder performance. This series is designed to be connected to associated circuitry through wire-bonding, conductive epoxy or soldering. Mini-Systems, Inc. time tested materials produce chip resistors with high stability, low noise and low TCR to provide the hybrid electronics industry resistor products with the highest standards available.

WATF Series - wrap around series solderable gold with nickel barrier OR nickel barrier pre-solder
HWTF Series - half-wrap around series solderable gold with nickel barrier OR nickel barrier pre-solder. The isolated pad is wire bondable.

CASE SIZE	TYPE	LENGTH “/mm	WIDTH “/mm	THICKNESS “/mm	LOW VALUES NiCr or [TaN] (Std. TCR)	STANDARD VALUES NiCr of [TaN]	POWER ALUMINA	POWER AIN	POWER BeO
0202	7	0.020”(0.508)	0.020”(0.508)	0.010”(0.254)	1<3 Ohm	3-130K[190K]	125mW	500mW	1W
0402	1	0.040”(1.016)	0.020”(0.508)	0.010”(0.254)	1<3 Ohm	3-200K[300K]	125mW	500mW	1W
0502	8	0.055”(1.397)	0.025”(0.635)	0.010”(0.254)	1<3 Ohm	3-250K[400K]	250mW	1W	2W
0603	63	0.060”(1.524)	0.030”(0.762)	0.010”(0.254)	1<3 Ohm	3-300K[500K]	250mW	1W	2W
1005	6	0.100”(2.54)	0.050”(1.270)	0.010”(0.254)	------	1-3.5M[5M]	500mW	2W	4W
1505	9	0.1.53”(3.886)	0.050”(1.270)	0.010”(0.254)	------	1-4M[6M]	750mW	3W	4W

ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS AND QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - WATF WRAP AROUND SURFACE MOUNT RESISTORS
Part Number - HWTF HALF-WRAP SURFACE MOUNT RESISTORS

Surface Mount Thin Film Resistors Datasheet
MOQ is typically 25pcs. Price breaks: 25-49, 50-99, 100-249, 250-499, 500-999, 1000-2499, 2500-4999, 5000-9999, 10K+
Samples may be available on request - please contact us with your requirements to check availability.