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DIE PICKUP TOOLS

Die Collets

Die Collets offer the user minimum contact between the die and the tool. Only the die edges are pressed against the die collets inverted pyramidal polished walls. Die collet advantages are maximum available vacuum surface, no physical contact with the sensitive top surface of the die as well as other benefits. Available as :

PL PERIPHERAL DIE COLLETS

2 SIDED DIE COLLETS

4 SIDED DIE COLLETS

Pickup Tools/Tips

Available in a wide range of materials and styles to suit different applications. Materials include Silicone, Delrin, Torlon, Tungsten Carbide, Vespel, and different types rubber.

2151-CT THREADED REPLACEABLE CONICAL TIP

RTR / HRTR PICKUP TIPS

RTR-D2/RTR-D3 FRAGILE PART PICKUP TOOLS

F/ PCTR PURE CONICAL TIP RUBBER

RPCT REPLACEABLE PLASTIC PICKUP TOOLS

CT CONICAL PICKUP TOOLS

RT RECTANGULAR PICKUP TOOLS

ST SILICONE TIP PICKUP TOOLS

SC & HSC SUCTION CUP PICKUP TOOLS

SPECIAL / CUSTOM PICKUP TOOLS

Pickup Tool Material Options

Die Pickup tools are available for all of the following Bonders and many others not listed.

ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond, Viking Semicon and other die bonders.

Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.

09/03/2010 16:03

Latest News:

09.03.2010

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

14.01.2010 Southern Manufacturing Show. Epak Electronics Will be exhibiting at Southern Manufacturing in Farnborough 10th & 11th February 2010.

#500 Exhibitors

# FREE Tickets (when pre-booked)

# FREE Parking

# FREE Seminars

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers.

16.04.09 Comco to Exhibit at InterSolar Munich

Comco Inc. will exhibit micro-abrasive blasting equipment at the InterSolar Munich show, May 27-29, 2009, New Trade Fair Center, Munich, Germany booth A3.208.

11.01.09

27.10.08 SPT RTR-D2/D3 series pickup tips for thin or fragile components

14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles.

18.04.08 NEW from AI Technology : COOL-SILVER^{TM CPU
Thermal Grease gives 2-3
degree centigrade lower temperatures over the industry
"standards" even for a medium performing CPS for longer life
of the processors and electronic devices.}

19.03.08 : New Website Launched