Bonding Capillaries, Wedges, Pick Up Tools and Dispensing Nozzles Epoxies, Adhesives, Thermoplastic Films and Thermal Gel and Greases Micro-Abrasive blasting equipment, media and systems UV Curing equipment, spares and accessories Wafer, dicing and protective tapes including UV and pressure release tapes Thin Film & Thick Film Chip Resistors, Arrays, Networks, Attenuators, MOS Chip Capacitors and Jumpers Precision Die Bonders, pick and place systems, die eject systems and wafer film mounters
 

Abrasives

Adhesives & Epoxies

Air Dryers

Blast Cabinets (Abrasive)

Bonding Capillaries

Bonding Wedges

Chip Capacitors

CO2 Cleaning

Custom Product Solutions

CPU Cooling (Cool-Silver)

Die Bonders

Die & Pin Eject Systems

Dicing & Wafer Tapes

Die Pickup Tools

Dispensing Systems

Diamond Wheel Dressing Solution

Dust Extraction 

Electronic Packages & Lids

Epoxy Stamping & Dispensing

Hot Gas/Rework Station

Ink Coating & Handling

Machine Guards (Custom Made)

Mask & Substrate Alignment

Maintenance & Shop Supplies

Micro Abrasive Systems

Micro Blaster Accessories

Micro Blasting Services

Pick & Place Systems

Printing Supplies &  Equipment

Resistors - Thin Film

Resistors - Thin Film Microwave & RF

Resistors - Thick Film

Safety Products

Silicon Doping Stains

Soldering Equipment

Solderability Testers

Solitec Spinners, Coaters and Developer support

Steam Aging Equipment

Storage Cabinets (Dry / Nitrogen & Custom)

Surface Abrader

Tapes (Wafer, Dicing & Protective)

Tape / Film Applicator / Mounters

UV Curing Control & Test Equipment

UV Curing Equipment

Wafer Backlap Applicator

Wire Bonding Wedges

 

 

Home Page

Applications

Contact Us 

Data Sheets

Links

Map & Directions

News

Products By Manufacturer

Site Map

Spares & Servicing

 

DIE PICKUP TOOLS

Die Collets 

Die Collets offer the user minimum contact between the die and the tool. Only the die edges are pressed against the die collets inverted pyramidal polished walls. Die collet advantages are maximum available vacuum surface, no physical contact with the sensitive top surface of the die as well as other benefits. Available as :

PL PERIPHERAL DIE COLLETS

2 SIDED DIE COLLETS

4 SIDED DIE COLLETS

Pickup Tools/Tips

Available in a wide range of materials and styles to suit different applications. Materials include Silicone, Delrin, Torlon, Tungsten Carbide, Vespel, and different types rubber.

2151-CT THREADED REPLACEABLE CONICAL TIP

RTR / HRTR PICKUP TIPS

RTR-D2/RTR-D3 FRAGILE PART PICKUP TOOLS

F/ PCTR PURE CONICAL TIP RUBBER

RPCT REPLACEABLE PLASTIC PICKUP TOOLS

CT CONICAL PICKUP TOOLS

RT RECTANGULAR PICKUP TOOLS

ST SILICONE TIP PICKUP TOOLS

SC & HSC SUCTION CUP PICKUP TOOLS

SPECIAL / CUSTOM PICKUP TOOLS

 

Pickup Tool Material Options

 

Die Pickup tools are available for all of the following Bonders and many others not listed. 

ASM, Alphasem, Amica, Assembly Tech, ESEC, ESC, Datacon, Delvotec, Air Vac, Dr Tresky, Foton, Hacker, Hughes, ISMECA, K&S, KME, Laurier, MRSI, Muehlbauer, Palomar, Quad, SEC (Semiconductor Equipment Corp), Shinkawa, Toshoko, Universal, West Bond, Viking Semicon and other die bonders.

Got a different manufacturers part or information ? No problem, we can offer equivalent parts, just contact us for a quote.  

03/09/2010 09:06

EPAK
Latest  News:
09.08.2010

BV9000 Videos Added & Epak Electronics YouTube video channel online

03.08.2010

Comco Celebrate 45th Year Anniversary

Started in 1965 Comco Inc have been in business selling microblasters for 45 years. Epak Electronics Ltd have been Comco's UK representative since 1970 - and have built up a wealth of information and experience in micro abrasive blasting over the last 40 years.

21.07.2010

RPS ANTHEM lead dipping, twin solder bath solderability system now shipping. With dynamic solder bath or wave nozzles, single or double static or dynamic flux baths and available with optional rotary head for QFP packages. Epak have already shipped and installed the first Anthem in the UK.

   

 

09.07.2010

NEW UV-C Intensity Labels Available. Now a label is available specifically to target UV-C intensity measurement. Available now.

MORE DETAILS

09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet
18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

       27.10.08       SPT RTR-D2/D3 series  Special Pickup Tips for thin or fragile components
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Epak Custom Equipment - Custom Machine Guarding

All Information and images are © copyright of Epak Electronics Ltd and our Principle Companies. No unauthorised duplication.