Surface Abrader - SA150 Precision Micro Abrasive Surface Abrader - SA150 and NEW SA152

Surface Abrader using Micro Abrasive Blast Technology For MEMS, LAB on Chip Applications, Accelerometer and Microfluidic Applications

SA150 PRECISION SURFACE ABRADER

The SA150 precision surface abrader, SA150, will abrasively clean or texture thin flat parts up to 150mm wide, 150mm long and up to 20mm thick. The system comprises of a Comco DF1400-2CE abrasive blaster, which sits underneath the main unit on a gurney. Connected into the back of the main table is an extract port for connecting to a suitable dust extractor.

The standard machine occupies a floor area approximately 700mm x 700mm and the conveyor height is 1100mm from the floor. The overall conveyor is 600mm long and is 170mm wide. Abrasion resistant polyurethane belts make up the conveyor belt.

The abrasive blast area is enclosed so that very little dust will escape with the correct extraction flow. The chamber is illuminated and has a large front window so the operator may view the part being processed. The blast enclosure is fixed on a hinge at the back of the cabinet and can be lifted to allow adjustment or changing of the blast head. As standard the machine comes fitted with two nozzles, however, we are able to offer single nozzle and triple nozzle heads if needed.

Parts are placed on the conveyor belt on the left hand side of the machine and are run under a laser sensor, which automatically detects the front leading edge of the part. Parameters for part length, pass width, pass speed, the number of passes across the part, the index distance between passes, and the reprocess steps, can all be changed via the SA150 control panel. A save feature allows the current process parameters to be saved into memory.

The automatic conveyor belt passes through the blast chamber, underneath the two blast nozzles. The forwards/backwards motion is controlled by the pass speed and pass width parameters within the settings. Left to right motion is pre determined for the conveyor speed. A large window is on the front of the blast chamber allowing the operator to see the parts being processed and to monitor their progress. The blast chamber is also fitted with a lamp to aid visibility during use of the machine. The control panel on the right hand side allows the user to change the process parameters quickly and easily for the system.

Adjustable side plates allow for larger components to be passed through the machine and to allow adjustment on the extraction airflow. The blast chamber is hinged to allow full access to the head for setting the height of the blast nozzles. The nozzle height is adjustable depending on the thickness of the part being processed.

Safety interlocks prevent the machine from being run when there is no dust extraction present, or when the protective blast chamber is open. Whilst abrasive blasting is in progress, if there is a drop in pressure or extraction or if the blast cabinet is opened, the SA150 will stop the cycle to prevent any damage or danger to the parts being processed.

The entire nozzle drive mechanism is enclosed to exclude dust. The nozzle drive arms in the top of the abrasive chamber are completely covered with extendible bellows.

The whole system requires clean, dry air. A 220v, 50Hz power supply for the SA150 is required. The DF1400-2CE is powered directly from a special socket on the SA150. The Filtex FX50H requires a separate 400v, 3 phase power supply and for the control box to be mounted at a convenient location near the dust extractor.

Glass Wafer processed using SA150 to create blind hole pattern in surface

Surface Abrader using Micro Abrasive Blast Technology For MEMS, LAB on Chip Applications, Accelerometer and Microfluidic Applications

(close up) Glass Wafer processed using SA150 to create blind hole pattern in surface

Surface Abrader using Micro Abrasive Blast Technology For MEMS, LAB on Chip Applications, Accelerometer and Microfluidic Applications

Glass Wafer processed using SA150 to create thru hole pattern in surface

Surface Abrader using Micro Abrasive Blast Technology For MEMS, LAB on Chip Applications, Accelerometer and Microfluidic Applications

(close up) Glass Wafer processed using SA150 to create thru hole pattern in surface

Surface Abrader using Micro Abrasive Blast Technology For MEMS, LAB on Chip Applications, Accelerometer and Microfluidic Applications

 

Part Number - Epak SA152 Surface Abrader SystemPRICE QUOTE - email us at sales@epakelectronics.comEpak SA150 Surface Abrader Datasheet

 

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