Bonding Capillaries, Wedges, Pick Up Tools and Dispensing Nozzles Epoxies, Adhesives, Thermoplastic Films and Thermal Gel and Greases Micro-Abrasive blasting equipment, media and systems UV Curing equipment, spares and accessories Wafer, dicing and protective tapes including UV and pressure release tapes Thin Film & Thick Film Chip Resistors, Arrays, Networks, Attenuators, MOS Chip Capacitors and Jumpers Precision Die Bonders, pick and place systems, die eject systems and wafer film mounters
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Abrasives

Adhesives & Epoxies

Air Dryers

Blast Cabinets (Abrasive)

Bonding Capillaries

Bonding Wedges

Chip Capacitors

CO2 Cleaning

Custom Product Solutions

CPU Cooling (Cool-Silver)

Die Bonders

Die & Pin Eject Systems

Dicing & Wafer Tapes

Die Pickup Tools

Dispensing Systems

Diamond Wheel Dressing Solution

Dust Extraction 

Electronic Packages & Lids

Epoxy Stamping & Dispensing

Hot Gas/Rework Station

Ink Coating & Handling

Machine Guards (Custom Made)

Mask & Substrate Alignment

Maintenance & Shop Supplies

Micro Abrasive Systems

Micro Blaster Accessories

Micro Blasting Services

Pick & Place Systems

Resistors - Thin Film

Resistors - Thin Film Microwave & RF

Resistors - Thick Film

Safety Products

Silicon Doping Stains

Soldering Equipment

Solderability Testers

Solitec Spinners, Coaters and Developer support

Steam Aging Equipment

Storage Cabinets (Dry / Nitrogen & Custom)

Surface Abrader

Tapes (Wafer, Dicing & Protective)

Tape / Film Applicator / Mounters

UV Curing Control & Test Equipment

UV Curing Equipment

Printing Supplies &  Equipment

Wafer Backlap Applicator

Wire Bonding Wedges

 

 

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UV Process Supply UV Cure Equipment & Accessories Comco Microblasting Equipment RPS Steam Ager ST2 DTIC Dispensing Equipment Comco Inc Micro abrasive blasters  

Mini Systems Inc Electronic Packages Dry or Nitrogen Storage CabinetsAB Manufacturing Mask Aligners and Substrate AlignmentCO2 Cleaning and degreasing Systems from PURCO2 Custom Machine Guarding and Panels Dust Extraction and Collection Systems

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Epak Electronics Ltd is a European based technical  representative of an outstanding range of high technology products predominantly from the USA. 

Our range of products we supply includes high specification thin film and thick film chip resistors for military, space, medical and telecommunications industries, glass wall and metal packages, specialist adhesives and epoxies for the  electronics industry, CO2 cleaning systems, micro-abrasive systems for surface preparation cleaning and rework, semi-automatic bonders and manual pick and place equipment, wafer tape and applicators, die eject systems, soldering test systems and solder pots, dispensing equipment and a range of die bonding tools, capillaries and bonding wedges. 

Epak undertakes the installation and subsequent servicing of all our principals products along with the highest quality technical backup available.

Our newest product line covers UV curing equipment and spares, safety products, printing supplies and ink and coating handling products from UV Process Supply.   

Latest

Epak Electronics will be Exhibiting at the Southern Manufacturing Show. in Farnborough 10th & 11th February 2010.

Visit us on stand 347 Five, Farnborough, Hants.

More details of the show including directions and an exhibitor list can be found here


Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed. Designed to take from 30mm to 150mm (6") wafers. Click here for more details

Also available is our SA150 & SA300 Surface Abrader

14/01/2010 06:06

EPAK
Latest  News:

14.01.2010 Southern Manufacturing Show. Epak Electronics Will be exhibiting at Southern Manufacturing in Farnborough 10th & 11th February 2010.

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

16.04.09 Comco to Exhibit at InterSolar Munich

Comco Inc. will exhibit micro-abrasive blasting equipment at the InterSolar Munich show, May 27-29, 2009, New Trade Fair Center, Munich, Germany booth A3.208.

 

11.01.09

       27.10.08       SPT RTR-D2/D3 series pickup tips for thin or fragile components 
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

Adhesives & Epoxies - Bonding Tools - CO2 Cleaning - Thin Film & Thick Film Resistors - Electronic Packages - Dispensing Equipment - Micro Abrasive Systems - Die Bonders - Dicing Tape & Applicators - Dry Storage Cabinets - Thermal Interface Materials - UV Curing Systems & Accessories - Solderability Test Equipment - Steam Agers - Custom Machine Guarding

All Information and images are © copyright of Epak Electronics Ltd and our Principle Companies. No unauthorised duplication.