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EPAK BV9000 WAFER BEVELLER 

Over the years we have helped to provide custom solutions for applications where an off the shelf product is not available. 

Our latest custom build was for a customer needing a larger version of the old Comco BV8003 wafer bevellers. The BV9000 Wafer Beveller is designed to produce a pulley wheel bevel on wafers from 30 mm to 150 mm diameter.

Designed to integrate Comco Microblasters, the BV9000 is built on a table with self-leveling pneumatic vibration isolation feet supporting the spindle, blast chamber with extract port and incorporating a baffle.  To prevent problems with abrasive wear on the moving parts, there are two positively pressured chambers with doors containing the notch and cut off micrometer assemblies and the motorised stages also have separate positive pressure. The table provides sufficient space for three microblasters and parts. Beneath the bench two cabinets house the control system electrics/electronics and pneumatic and vacuum controls.

The spindle and chuck holding the wafer is designed to run at speeds up to 800 rpm.

The cut off blast head assembly is retractable for loading and unloading and adjustable in X-axis for position relative to the wafer.  The cut off heads are adjustable in X, Y, Z and azimuth. The upper cut off head is motorised in X-axis.

The notch blast head assembly is retractable for loading and unloading and adjustable in X-axis for position relative to the wafer. The notch head is to be adjustable in Y, Z, tilt and rotational theta axis. The notch head to be motorised in Z-axis.

Both notch assembly and cut-off assembly adjustments provide travel, accuracy and repeatability The motorised X & Z stages can move to a repeatable position within 10 microns. Dial gauges allow for a simple, visual display of any adjustments made.

Two (2) camera and lens assemblies allow wafer centering and monitoring of the notch edge cutting process. The digital images are displayed on an LCD monitor.

Control system and user panel feature controls to allow ease of operation and repeatability of the process.

 

A video overlay generator provides alignment marks on the screen for checking the desired profile and for wafer centering.

The BV9000 allows easy integration for the new Comco Accuflo for even greater precision and blast performance.

   

 

Please contact us if you have a custom or automation requirement.

See here for our custom equipment gallery.

 

 

09/03/2010 16:04

EPAK
Latest  News:
09.03.2010 

Read Our Technical Article on Micro-Abrasive Applications in Micromachining in the latest Commercial Micro Manufacturing Magazine.

14.01.2010 Southern Manufacturing Show. Epak Electronics Will be exhibiting at Southern Manufacturing in Farnborough 10th & 11th February 2010.

#500 Exhibitors

# FREE Tickets (when pre-booked)

# FREE Parking

# FREE Seminars

21.10.09 Epak Custom Large Fossil Blast Cleaning Cabinet

18.09.09 Epak BV9000 Wafer Beveller Installed

Our latest custom project to build a larger scale Wafer beveller based around the Comco BV8003 has been delivered and installed.

Designed to take from 30mm to 150mm (6") wafers. 

16.04.09 Comco to Exhibit at InterSolar Munich

Comco Inc. will exhibit micro-abrasive blasting equipment at the InterSolar Munich show, May 27-29, 2009, New Trade Fair Center, Munich, Germany booth A3.208.

 

11.01.09

       27.10.08       SPT RTR-D2/D3 series pickup tips for thin or fragile components 
14.10.08 Safe-T-Stain : We are able to source all the Safe-T-Stains again in 8oz bottles. 
18.04.08 NEW from AI Technology : COOL-SILVERTM CPU Thermal Grease gives 2-3 degree centigrade lower  temperatures over the industry "standards" even for a medium performing CPS for longer life of the processors and electronic devices. 
19.03.08 : New  Website Launched

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