Mini-Systems Inc. High Value Wire Bondable Chip Resistor series offers the design engineer a wide variety of styles with the high stability of Thin Film materials to meet the demands of cutting edge design requirements. Electrical connection to associated circuitry is accomplished through wire bonding to terminations located on the top side of the chip.

Suitable die attachment methods are epoxy or eutectic attach.

MSHR Series - single resistor

MDHR Series - dual series resistors

MIHR Series - dual isolated resitors

CASE SIZE	TYPE	LENGTH “/mm	WIDTH “/mm	THICKNESS “/mm	RESISTANCE RANGE	POWER Quartz	POWER Si
0201	21	0.020”(0.508)	0.010”(0.254)	0.006”(0.152)	451K-1.8M	10mW	50mW
0202	122	0.020”(0.508)	0.016”(0.406)	0.010”(0.254)	1.1M-2M	25mW	125mW
0302	32	0.030”(0.762)	0.020”(0.508)	0.010”(0.254)	2.1M to 15M	50mW	250mW
0402	110	0.037”(0.940)	0.017”(0.432)	0.010”(0.254)	3.1M-20M	25mW	125mW
0404	4	0.040”(1.016)	0.040”(1.016)	0.010”(0.254)	11.1M-50M	70mW	350mW
0502	115	0.050”(1.270)	0.025”(0.635)	0.010”(0.254)	6.6M-45M	50mW	250mW
0603	63	0.060”(1.524)	0.030”(0.762)	0.010”(0.254)	11.1M-50M	100mW	500mW
0805	85	0.075”(1.905)	0.050”(1.270)	0.010”(0.254)	40.1M-100M	100mW	500mW

ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS AND QUANTIY FOR QUOTE OR ASSITANCE)
Part Number - MSHR SERIES HIGH VALUE WIRE BONDABLE RESISTORS
Part Number - MSDR SERIES HIGH VALUE WIRE BONDABLE RESISTORS
Part Number - MIHR SERIES HIGH VALUE WIRE BONDABLE RESISTORS

MSHR/MDHR/MIHR High Value Wire Bondable Thin Film Resistors Datasheet

MOQ is typically 25pcs. Price breaks: 25-49, 50-99, 100-249, 250-499, 500-999, 1000-2499, 2500-4999, 5000-9999, 10K+
Samples may be available on request - please contact us with your requirements to check availability.