Mini-Systems, Inc. Wire Bondable High Power Chip Resistor series is constructed with high current density Thin Film materials to fit the rigorous demands that operating high power have on performance. Connection methods to associated circuitry are made through either wire bonding, conductive epoxy or soldering to the terminations.

CASE SIZE	TYPE	LENGTH “/mm	WIDTH “/mm	THICKNESS “/mm	RESISTANCE RANGE	POWER Alumina	POWER AIN2,3	POWER BeO2,3
0202	122	0.020”(0.508)	0.016”(0.406)	0.010”(0.254)	2-1K	250mW	1W	2W
0302	32	0.030”(0.762)	0.020”(0.508)	0.010”(0.254)	1-1K	250mW	1W	2W
0404	2	0.035”(0.889)	0.035”(0.889)	0.010”(0.254)	2-1K	1W	2W	4W
0505	112	0.050”(1.270)	0.050”(1.270)	0.010”(0.254)	2-1K	1W	2.8W	5.6W
0805	3	0.075”(1.905)	0.050”(1.270)	0.010”(0.254)	2-1K	1W	4W	8W
1010	121	0.100”(2.54)	0.100”(2.54)	0.010”(0.254)	2-1K	2W	6W	12W
1505	9	0.153”(1.270)	0.050”(1.270)	0.010”(0.254)	2-1K	2W	6W	12W

ORDERING INFORMATION (PLEASE ADVISE REQUIREMENTS & QUANTIY FOR QUOTE OR ASSITANCE)

Part Number - PTWB TOP CONTACT HIGH POWER RESISTORS (PLEASE ADVISE SIZE, VALUE, TOLERANCE and QUANTITY)
Top Contact High Power Chip Resistors Datasheet
MOQ is typically 25pcs. Price breaks: 25-49, 50-99, 100-249, 250-499, 500-999, 1000-2499, 2500-4999, 5000-9999, 10K+
Samples may be available on request - please contact us with your requirements to check availability.